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 


    The reach of this pioneering material will soon expand, as it is set to


become available for the Jet Fusion 5600 Series later this Spring, broadening its application across HP’s suite of polymer 3D printing solutions. “From design to parts production and post processing, HP is committed


to delivering a broad range of innovative materials and programs for more sustainable production,” said Francois Minec, global head of 3D polymers. PA 12 S is expected to revolutionise the industry by reducing variable costs per part and significantly lowering the total cost of ownership. This material, in conjunction with HP Multi Jet Fusion technology, offers an optimised production process that streamlines post-processing steps, saving time and further reducing costs. These advancements enable manufacturers to produce parts more efficiently while maintaining high quality and sustainability standards.


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 


    This brand new innovation in


adhesive technology offers the unique capability of curing in thicker layers using UV light alone, eliminating the necessity for secondary curing methods. In addition, these innovative materials can be shipped and stored at room temperature, a significant improvement over conventional black-coloured


epoxy adhesives that require cold or deep-freeze conditions. The range is made up of three products which cater to a wide range of applications, including component encapsulation, glob top, edge bonding in electronics production, and optical adhesives requiring high OD values. Offering high glass transition temperatures, low shrinkage, and low coefficient of thermal expansion, all three adhesives ensure reliable bonding results with excellent thermal and positioning stability. Experience the versatility and reliability of Black&Light technology and


the possibility these new grades bring for customised adhesive solutions tailored to specific curing conditions and mechanical properties. Speak to the technical experts at TECHSiL for more information.


    


 


      “Digital transformation is coming, and it will profoundly alter the competitive landscape in the machine building industry, with smart technology greatly improving the efficiency of critical processes.” said Ben Sheath, VP and managing director, UK & Ireland, Siemens Digital Industries Software. “Machine builders who are digitally ready can respond to market trends and customer demands faster, better, and at a lower cost. The old objections of scalability and affordability no longer apply. “Our technologies make it easy to bring production machinery online, to


pilot a digitalisation initiative on a single machine and then scale across the full global footprint of the enterprise. Plus. the changes announced to the UK Spring Budget allow companies to write off the full cost of IT equipment, plant and machinery against taxable profits in the year of investment, instead of over the life of the asset. The first-mover advantages will be enormous. The time to act is now. And we’re here to help.”





 


    The changes will have implications for the whole supply chain, requiring a


wide ecosystem of essential service providers and manufacturers to rapidly advance cybersecurity maturity to minimise risk. In both the UK and EU, connected businesses throughout the supply chain will be expected to be cyber secure, with responsibility extending to friendly third parties connected to systems through remote access. For utilities, this is especially crucial as any business involved in the supply chain risk huge fines. Schneider Electric’s cybersecurity assessments entail a holistic defence-in- depth approach which encompasses everything from technology to human factors, how systems are delivered, how assets are maintained and secured, and how to deliver improved resilience over the medium to long term. This approach meets the same requirements as NIS 2 in many ways, however is driven by outcome and aims to go beyond minimum requirements. Schneider Electric is on a mission to support businesses across the board


as they move beyond just NIS 2 compliance and into better protected utilities, future-proofing operational assets to be more resilient to changed threats.


8  


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