Adhesives, encapsulants, and coatings
are commonly used for wearable device applications such as electronics encapsulation, needle to hub bonding, component edge bonding, wire and flexible circuit staking, and battery reinforcement. When designing a wearable device, the engineer must consider whether the device causes skin sensitivity or can survive repeated use, exposure to different environments and extended periods of time on the body. Isobornyl acrylate (IBOA) is sometimes founds in adhesives as a diluent or plasticiser, but is a known skin irritant. Another material of concern is TPO (2,4,6-trimethylbenzoyldiphenyl phosphine oxide), a photo initiator. The Dymax 2000-MW series is the first dedicated light curable adhesive
range formulated specifically without materials of concern and common skin irritants. The series produces strong bonds on substrates used in the industry, including low surface energy plastics, and dependable performance against moisture and thermal shock. These materials contain no solvents, so environmental impact is minimised and worker safety is enhanced. In addition, there are formulations available that include Ultra- Red fluorescent technology to enable easy and clear process validation. Intertronics offers a broad range of adhesives for medical device assembly,
alongside the requisite dispensing, curing and surface preparation equipment.
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