FEATURE ELECTRICAL & ELECTRONICS
‘COMPONENT CARRIER’: An alternative solution to flexible circuit boards?
Although flexible circuit boards offer many advantages, the mechanical fixation of these is complex. HARTING has therefore developed a new solution based on 3D-MID technology
delivers benefits in small volumes, as the component carrier can be used for different applications without adaptation. The process is also said to achieve more precise component positioning, greater repeatability and better quality. Another advantage is the short
timeframe required to deliver finished components. Since the plastic carrier remains unchanged, all that is needed are specifications for placement of the electronic components. Experts in 3D-MID can use this to create a production- optimised layout proposal. Adjustments of the laser program are all that is needed to tailor the electrical traces to the respective application. Once the customer has approved the product and components have been received, initial production samples can be dispatched within two to three weeks.
APPLICATIONS HARTING has identified three example applications where the component carrier can replace flexible circuit boards: Components at a 90˚ angle to the
P
opular in many product areas, flexible printed circuit boards made
of thin polyamide films are established in many product areas. Populating and assembling these, however, is a complex process, states HARTING. The company has therefore developed
a standardised component carrier for electronic components. Using this, electronic components can be fitted directly onto the component carrier, thereby replacing flexible circuit boards, it explains. The component carrier serves as a connecting element between the printed circuit board (PCB) and electronic components such as LEDs, ICs, photodiodes and sensors. The populated component carriers are
delivered in tape and reel format. In their standard design, the carriers can be processed in automatic assembly systems, just like other SMD electronic components. There are currently two sizes available and these can accommodate electronic components of standard size SOIC-8 and smaller. The company can, however, produce the carriers in customer-specific sizes.
IN DESIGN Thanks to the 3D-MID (mechatronic integrated device) technology, electronic components can be fitted directly onto a three-dimensional body without the need for circuit boards or connecting cables. The base body is produced
36 MAY 2020 | DESIGN SOLUTIONS
through injection moulding, whereby the thermoplastic is provided with a non-conductive, inorganic additive. In order for this material to be able to accommodate electrical circuits, the additives in the plastic are ‘activated’ through laser direct structuring (LDS) where the laser beam writes the areas intended for the conductive tracks and creates a micro-rough structure. The metal particles released in the process form the nuclei for the subsequent chemical metallisation. This process creates electrical traces
across the three-dimensional base body. The plastic employed offers high thermal stability and can therefore be soldered in the reflow oven. The resulting component carrier
can be equipped with several sensors that, if desired, could be aligned in three directions to take measurements in three axes (X, Y, Z). Components can be fitted simultaneously on two parallel surfaces on the front and back sides, as well as on the end face.
THE BENEFITS In an automated process, HARTING fits electronic components such as LEDs, ICs, photodiodes and sensors directly on the component carrier. The total cost of the component carrier is two-thirds lower than those of flexible PCB solutions, the company claims. The process also
circuit board: The component carrier is suitable for scenarios in which electrical components, such as sensors, need to be positioned normal to the circuit board. The automatic assembly process enables the placement of temperature sensors or hall sensors on the carrier to a high degree of accuracy, which in turn results in precise, reproducible measurements. Optical components are another salient example, such as LEDs or photodiodes used to generate precise light barriers. Clearance from the circuit board:
The component carrier also makes it possible to maintain a clearance between the circuit board and an electronic component. Consequently, a temperature sensor can be used to measure the temperature in the housing without being influenced by the waste heat from other components on the PCB. It also means that an LED can be placed clear of the circuit board, thereby avoiding the
risk of surrounding components
The smaller design of the component carrier is suitable for components of size SOT23 and smaller – with its dimensions of approximately 5 x 4 x 3mm
casting shadows. • Antenna function: The component
carrier can be manufactured using different base polymers. In this way, different antenna material properties can be factored in, such as dielectric constant and loss factor. The specific antenna layout can be used for various applications in the MHz and GHz frequency range, such as Bluetooth, WiFi, ZigBee and 5G.
HARTING
www.harting.com/UK/en-gb
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