ELECTRICAL & ELECTRONICS


ENCLOSURES FOR PCBs WITH PROTRUDING CONNECTORS


OKW’s TOPTEC universal plastic enclosures allow PCBs with protruding connectors and interfaces to be mounted directly into the case. There are 28 models, including Type F (flat top)


and Type H (high top). Sizes range from 102 x 54 x 30mm to 194 x 115 x 46mm. These versatile ABS (UL 94 HB) enclosures are


ideal for desktop and wall-mount electronics. Applications include monitoring, signalling equipment, control systems, medical/wellness devices, computer peripherals, IoT and IIoT.


OKW Enclosures www.okw.co.uk/en


PRODUCTS COMPACT SOLID-STATE RELAY SUITS HIGH-FREQUENCY SWITCHING APPLICATIONS


DOLD has introduced the RK 9260 solid-state relay (SSR), the latest innovation in its POWERSWITCH series. Engineered for frequent no-wear and


noiseless switching of resistive loads, the RK 9260 is suitable for heating, cooling and lighting systems. Its ability to switch at zero crossing, minimising electrical noise, enables its use in high-frequency applications such as plastic injection moulding machines, thermoforming, solder lines and packaging machines. The RK 9260 can monitor and manage high in-rush currents up to 165A for 20ms at 230V AC. This addresses a common challenge in many systems, such as LED Lighting control, by switching short but very high in-rush currents that often occur at start-up. Integrating the RK 9260 within the system design helps LED lamps operate smoothly, reducing stress on the relay and minimising the risk of failures and downtime. Another key feature that improves performance is its use of Direct-Copper-Bonding (DCB)


Technology. This method bonds a copper heat sink directly to the ceramic substrate, efficiently dissipating the heat generated by switching high currents within the relay. As a result, operational temperatures are kept lower, extending the life of the relay. Measuring just 17.5mm in width, the RK 9260 is highly resistant to vibrations and shocks. It supports a load current of up to 5A and promises an extended lifespan due to its high switching frequency and robust build. Thanks to its user-friendly, plug-and-play design, the RK 9260 can be quickly and easily integrated into systems, the company explains.


DOLD T: 01245 324432


HIGH PERFORMANCE POWER MOSFETS IN COPPER-CLIP DESIGN


Nexperia has launched 16 new 80V and 100V power MOSFETs in the innovative copper-clip CCPAK1212 package. The copper-clip design is said to provide high current conduction, reduced parasitic inductance, and excellent thermal performance. These features make the devices ideal for motor control, power supplies, renewable energy systems, and other power-hungry applications. Also included in the range are application-specific MOSFETs (ASFETs) designed


for AI server hot-swap functions. With top-side and bottom-side cooling options, these MOSFETs in CCPAK provide high power density and reliable solutions. All devices are supported by JEDEC registration and Nexperia’s interactive datasheets for seamless integration. The benchmark PSMN1R0-100ASF is a 0.99 mΩ 100 V power MOSFET capable


of conducting 460 A and dissipating 1.55 KW of power, yet in a CCPAK1212 package footprint that occupies only 12mm x 12mm of board space. The PSMN1R0-100CSF offers similar statistics in a top-side cooled version. The ‘CC’ in CCPAK1212 stands for copper clip, meaning that the power MOSFET silicon die is sandwiched between two pieces of copper, the drain tab on one side and the source clip on the other. With wire bonds entirely eliminated, such an optimised assembly offers a low on-resistance, reduced parasitic inductances, high maximum current ratings and excellent thermal performance. The Nexperia CCPAK1212 announcement also includes some new application specific MOSFETs (ASFETs) targeting the hot-swap function in increasingly powerful AI servers. These devices feature an enhanced safe operating area (SOA), providing superior thermal stability during linear mode transitions.


Nexperia www.nexperia.com


www.dold.co.uk HIGH-POWER CHIP RESISTORS


KYOCERA has expanded its selection of CR Series high-power chip resistors with the addition of the industry’s highest power 0603 resistor. These are non- magnetic, RoHS compliant, qualified to MIL-PRF-55342, manufactured in ISO-9001 facilities, and proven to deliver high-reliability performance in a wide range of high-power and high-frequency applications. The resistors, which were developed to enable the miniaturisation of RF power amplifiers, also address common size constraints and improve thermal management thanks to the use of a high-thermal- conductivity substrate and maximised heat sink grounding area. The resistors feature proprietary thin film resistive elements, aluminium nitride substrates, and silver terminals. They are currently available in eight chip sizes extending from 0603 to 3737 with two standard resistive values (100Ω and 50Ω), capacitance values spanning 0.3pF to 6.0pF, a power handling capability of up to 250W, rated operating temperatures extending from -55˚C to +150˚C, and resistive tolerance as tight as ±2%. They are also available with non-standard values as low as 10Ω and as high as 200Ω, and with standard tape and reel or anti-static waffle packaging. The new 0603 CR Series high-power chip resistor is rated for 0.3pF and up to 2.6W. Applications are in instrumentation, test and measurement,


military and defence markets, and include high-power RF amplifiers, dummy loads, shunts used for power measurement, and discrete resistive baluns used for impedance matching.


KYOCERA www.kyocera-avx.com DECEMBER/JANUARY 2025 DESIGN SOLUTIONS 47


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