• • • DEFENCE TECHNOLOGY • • •


SAM equipment has evolved and is now being used to detect subsurface flaws, dis-bonds, cracks and other irregularities in these types of materials that constitute the ‘packaging’ of semiconductor components. Today, the same rigor of quality testing and failure analysis is also being applied to validate the integrity of diffusion bonded metals. When bonding similar materials, bond strength can approach that of the base metal itself. For dissimilar materials, bond performance depends on the type of intermetallic compounds that form, the thickness of the intermetallic layer and the presence of microscopic defects such as voids at the interface. To ensure the quality of the interface, materials engineers must analyse samples to validate the quality of the bond. For both electronic and material testing, SAM operates by directing a focused beam of ultra-high-frequency sound from a transducer onto a tiny point on the target object. The sound is either scattered, absorbed, reflected, or transmitted as it passes through the material. By detecting the direction of scattered pulses and measuring their time of flight (TOF), the system determines the presence of a boundary or object and calculates its distance.


Three-dimensional images are created by scanning point by point and line by line on an object. Scan data is digitally captured and processed by special imaging software and filters to resolve a specific area of focus in either single or multiple layers. Specialists can analyse SAM images to detect and characterise device flaws such as cracks, delamination, inclusions and voids in bonding interfaces as well as evaluate soldering and other interface connections on PCBs. As important as the mechanical aspects are when conducting a scan, the software is critical to improving the resolution and analysing the information.


Multi-axis scan options enable A, B and


C-scans, contour following, off-line analysis and virtual rescanning for composites, metals and alloys, which result in highly accurate internal and external inspection for defects and thickness measurement via the inspection software. Various software modes can be simple and user friendly,


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advanced for detailed analysis, or automated for production scanning. An off-line analysis mode is also available for virtual scanning. “PVA TePla OKOS decided early on to deliver a


software-driven, ecosystem-based solution,” explains Polu. The company’s ODIS Acoustic Microscopy software supports a wide range of transducer frequencies from 500 KHz to 230 MHz. These software capabilities not only expand SAM’s functionality, but they also set the stage for tackling one of the industry’s toughest demands: combining speed with resolution. A common challenge with other inspection systems is performing scans quickly enough to remove defective materials without sacrificing resolution. Fortunately, recent advancements in SAM technology have significantly improved throughput speeds and


defect detectability, while maintaining image quality. “While a


conventional 5 MHz sensor could take 45 minutes to inspect a 10-inch square alloy, an advanced phased array [SAM] reduces that inspection time to five minutes with more granular detection of small impurities or defects,” says Polu. “Every company will eventually move towards this level of failure analysis because of the level of detection and precision required for specialty metals and materials,” says Polu. “The cost advantages and time savings of Industrial SAM equipment make this possible.”


ELECTRICAL ENGINEERING • NOVEMBER 2025 13


From semiconductor packages to high-purity metals, SAM extends inspection to the finest details that conventional methods overlook. As aerospace and defense platforms continue to push the limits of performance, this level of testing is no longer optional, it is essential to ensuring reliability under the harshest conditions.


www.pvatepla-okos.com


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