TECHNOLOGY IN ACTION ADVERTORIAL
with the goal of providing insight for things we currently don’t appreciate. From the perspective of a global connector manufacturer operating in the competitive international market, the IoT presents an opportunity to integrate electronics into “dumb” connectors in order to create smart interfaces that can provide more functions for the IoT. Creating this network of disparate device requires an understanding of system processes, protocols and constraints, as well as detailed knowledge of signal integrity and noise immunity. Complex issues can be resolved by internal development and production capabilities.
Over the years, Molex has utilised internal growth and acquisitions to expand its product portfolio with connectors (FCT electronic, GWConnect®) special cables (Affinity, Temp-Flex® and Flamar) and electro-optical systems (Polymicro Technologies fibre bundles and capillary tubes, QuatroScale™ products in CMOS silicon photonics technology for active optical cables and Oplink fibre-optic components).
Media interface activities (Media Connectivity Modules; MCM) have been enlarged and manufacturing facilities for flexible circuits in the USA and Taiwan as well as the recent acquisition of Soligie Printed Circuit provide a solid basis for further growth in integrated modules.
The Molded Interconnect Devices (MID) production centre in Shanghai develops and produces three-dimensional circuits, antennas and other components with metallised plastic substrates.
Source: Molex 2.4 GHz MID surface-mount antenna for reflow soldering (3x3x4 mm)
Source: Molex
WiFi/ISM adhesive antennas with UFL plugs (9x35 mm)
The expertise centre for industrial communication offers software developer kits, network cards, communication modules and diagnostic devices for Profinet†, Profibus† and EtherNet/IP‡, which are developed in collaboration with partners in the semiconductor sector.
Suitably configured, they can fulfil all requirements of IoT and Industry 4.0 for network technology, and for many new applications in the industrial electronics realm.
The standards for this have been defined (IEEE 802.3, for example with M12 connectors or perhaps even smaller) and are adapted to market demands.
However, many previously wired connections are being replaced by wireless networks (IEEE 802.11), which benefit from smart antenna technology.
Finally, infrastructure expansion (LET, 5G) and associated gigabit routers with native throughout rates of 25 Gbps or more create many opportunities for applications that go beyond data transmission over copper wire or copper PCBs and require ICs with fibre optic interfaces (silicon photonics).
This means that in the connector industry as well, Industry 4.0 will open up new and interesting ways to meet the demands of the automation trend.
We should all be aware of the ID of the Internet of Things now. After all, it’s not such an IDIoTic idea. † Profinet and Profibus are registered trademarks of Profibus International (PI). ‡ EtherNet/IP is a registered trademark of ODVA.
www.molex.com / ELECTRONICS ELECTRONICS | SEPTEMBER 2015 S13
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60