Advertorials AWS Electronics gains full TS 16949:2009 Approval


for Slovakia facility Cements AWS’ position as leading EMS provider for Automotive market


AWS Electronics Group, one of Europe’s leading specialist electronics manufacturing services (EMS) providers, has announced that its facility in Námestovo, Slovakia, has achieved full TS 16949 certification, the international standard for Automotive Quality Management Systems.


AWS Electronics has invested significantly in its Slovakia facility since its inception nine years ago. There have been several phases of expansion. The company moved from its original location onto a Green Field site in 2010. Since that time the facility has seen two further expansions in manufacturing space, taking the


total factory now to a size of 38,000 ft². The original dedicated high volume automotive hall has also recently been expanded with the addition of a second automotive line.


The Námestovo site now employs over 250 employees and has seen revenue growth of 25% year on year over the last four years. Achieving TS 16949 approval has been critical to cementing AWS’ position as a leading EMS provider to the automotive market, demonstrating a dedicated and thorough understanding of how to provide exceptional quality and process control as well as a world class manufacturing set up within a low-cost environment.


AWS Electronics Group Tel: 07799412771 www.awselectronicsgroup.com


OMC expands into new manufacturing facility to meet


increased demand for innovative opto solutions Fibre optics & backlights pioneer responds to sustained growth


OMC, the pioneer in optoelectronics manufacturing, has completed its move into a new, purpose-built manufacturing facility, reflecting an increase in demand for both its bespoke and off-the-shelf optoelectronic solutions. The company - known for its LED and fibre-optic expertise as ‘the problem solvers’ - has seen significant growth in two areas, customer-specific LED backlighting for LCD displays, and fibre optic cable assemblies, transmitters and receivers for use in industrial applications. The move into a state-of-the-art new facility will, they say, enable the company to support this growth and develop new solutions.


Explains OMC’s Commercial Director, William Heath: “We have occupied several facilities during our 30+ year history, and are delighted to have now constructed a factory designed specifically for our complex needs. We have dedicated development and assembly departments, as well as specialist test areas and a new machine shop capable of both prototyping and mass component production.”


OMC Tel: 01209-215424 www.omc-uk.com


Texas Instruments’ IoT-focused CC3120 SimpleLink


Wi-Fi Network Processor Now at Mouser Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is now stocking the CC3120 SimpleLink™ Wi-Fi network processor from Texas Instruments (TI). Part of TI’s SimpleLink microcontroller platform, the CC3120 Wi-Fi Internet-on-a chip™ device is comprised of a wireless network processor and power management subsystems, featuring a dedicated ARM®


Cortex® -M3


microcontroller. The device allows for optimal network flexibility and maximum connectivity for Internet of Things (IoT) solutions for a multitude of microcontroller applications.


The TI CC3120 SimpleLink Wi-Fi network processor,


available from Mouser Electronics, allows designers to run Wi-Fi and Internet protocols implemented in the ROM, which in turn runs its dedicated on-chip ARM Cortex-M3 network processor to significantly offload the host microcontroller and simplify system integration. The on-chip microcontroller helps to completely offload Wi-Fi and Internet protocols from the application microcontroller, handling all the details of Wi-Fi connectivity — including identity, data and code security — without requiring any host processor resources. To simplify the integration and development of networking applications, the CC3120 is supplied with a slim and user-friendly host driver that can be easily ported to most platforms and operating systems. This flexibility essentially enables a designer to connect to just about any microcontroller to the IoT cloud using the CC3120.


To learn more about the CC3120 processor and associated development tools, visit: http://www.mouser.com/new/Texas-Instruments/ti-cc3120r-simplelink-processor/


Increased investment in cable assembly facility wins


Harwin new business in space and avionics sector Advanced machinery and capabilities deliver superior quality; specialist in prototype and early builds; no MOQ


Leading hi-rel connector and SMT board hardware manufacturer Harwin has announced that increased investment in its Salem, New Hampshire cable assembly facility is winning new business in the demanding and highly specialised space and avionics sector. At its USA site, Harwin’s cabling capabilities include building to customer datasheet, prototyping, and electrical and mechanical testing of both cable and wire harnesses and coaxial cable assemblies. Over the past twelve months, increased investment in equipment plus intensive additional staff development and training, has led to successful fulfilment of orders from a number of high-tech customers with exceptional quality requirements.


Prototypes and small builds for early stage projects with the additional advantage of no MOQ are a Harwin speciality proving particularly attractive to space and avionics customers. Harwin already boasts a strong presence in these markets through its world-class Hi-rel connector ranges, in particular, the award- winning 1.25mm pitch Gecko interconnect, which has been specified on multiple programmes from satellites and CubeSats to mission and safety-critical aircraft control systems.


Additional investment at Salem has resulted in an expanded QA Department, additional training - all of the cable assembly facility’s operators are trained to IPC620 crimping standards – and upgrading of warehouse management systems. Additional machinery purchased includes extra electrical testing stations, post- potting ovens, and the very latest wire cutting and stripping machinery.


Harwin Tel: 02392 314 532 www.harwin.com


Simplified and accurate PCB line testing with Oxley SMOX Series test terminals – now at Aerco


Unique connection system with low contact resistance and gentle detachment; suits automated or manual assembly processes


The Oxley SMOX Series of surface mount test terminals for PCB assembly line testing is now available from Aerco, the distributor and stockist of electrical and electronic components servicing hi-rel markets. The SMOX Series has a unique retention mechanism which enhances reliability through low stress contact. Two different versions are available– HT Type SMOX for use with RoHS compliant lead-free solders (high temperature) and Standard Type SMOX for use with tin solders (lower temperature). The SMOX Series is compatible with pick and place machines for automated manufacturing processes and also available loose for hand assembly.


Featuring a specially designed socket, the SMOX Series is the only surface mount ball and socket test point currently available on the market offering easy low contact resistance and gentle detachment. The single pole devices require a tiny minimum pad size of only 2mm, so are suitable for testing even very tightly congested PBC designs. Highly resilient, they can be used over a temperature range of -55degC to +125degC. The test point and socket body is manufactured from copper alloy with a gold-plated test point finish as standard, optional Palladium, silver, nickel, tin lead finishes are also available.


Other technical specifications include maximum contact resistance of 2m , socket insulation resistance of 10,000M . Typical retention force is 0.2Kg (angles < 60 degrees or ± 30 degrees) off perpendicular and typical retention torque of 200gcm (angles > 30 degrees or perpendicular). Solderability exceeds the requirements of BS2011 (IEC 68) Test T and meets MIL-STD-202 Method 208.


Aerco www.aerco.co.uk


Second generation Grid-EYE infrared sensors with improved NETD from Panasonic now in


stock at TTI, Inc. The much improved and accurate second generation of Panasonic’s Grid-EYE infrared array sensors is now available in Europe through TTI, Inc., a world leading specialist distributor of electronic components. The new high gain types (AMG8833 and AMG8834) and low gain types (AMG8853 and AMG8854) of Grid-EYE 2nd Generation benefit from an improved NETD (Noise Equivalent Temperature Difference) of 0.16°C at 10Hz and of 0.05°C at 1 Hz. For all Grid-EYE 2nd Generation models the detection distance has improved from 5m up to 7m. It is important to note that the second generation of Grid-EYE sensors is fully compatible with the existing first generation designs. This means that the engineers can now get improved and accurate results when they use the sensor in their applications. Panasonic is committed to improve the customer experience and provide much more application benefits with the improved MEMS technology.


Based on Panasonic’s MEMS (Micro Electro Mechanical Systems) technology the Grid-EYE 2nd Generation infrared array sensors combine a more sensitive MEMS sensor chip, a digital ASIC (I2C interface) and a silicon lens in the same small package. The parts feature 64 thermopile elements in an 8x8 grid format that detect absolute surface temperature without any contact. Unlike conventional sensors, Grid-EYE uses a patented 60° silicon lens etched out of a silicon wafer, which is (with less than 0.3mm height) the smallest available lens in the market. The combination of these technologies allows for a sensor package size of only 11.6mm x 8mm x 4.3mm, which is around 70% smaller in size than competitors’ products.


TTI, Inc. www.ttieurope.com


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48