TECHNOLOGY IN ACTION
Optical Bonding facility T
he Display Technology Ltd Optical Bonding facility is now optimised to produce zero optical defect results, compared to other suppliers who would offer a ‘cosmetic spec’ allowing for imperfections.
Optical Bonding is a method of applying a CONTA-CLIP fuse
disconnect terminal with extraction lever for a spare fuse
F SIK 4-type fuse disconnect CONTA-CLIP feature a folding
terminals extraction
from lever
that locks into its end position and provides space for a spare fuse. Alternatively, CONTA-CLIP also supplies the fuse disconnect terminals with an integrated LED status display. The pressure spring connection system (PushIn) allows fast and safe contacting of the wires. A cross-connection channel within
the fuse disconnect terminals allows for
potentials to be distributed to adjacent fused terminals from the FSIK series. For multiplying the potentials, CONTA-CLIP offers the FQI standard connection system, available with 2 to 10 poles. Using VBS connection sleeves, two or three extraction levers can be coupled and operated simultaneously. FSIK 4 housings are made from polyamide 6.6 UL 94 V-0.
CONTA-CLIP Tel: +49 . 52 57 . 98 33 - 72 Web:
www.conta-clip.com
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silicone layer to fill the air gap between the front of the LCD and the rear of the filter/touchscreen. Our method involves a similar process to that used in the smartphone / tablet industry where a multi-cavity tool allows semi-automated production, which ensures consistency and speed of production.
The main advantage of Optical Bonding is that by removing the air gap the internal reflected light is reduced which gives a dramatically improved contrast in high ambient light conditions without an increase in power.
Other advantages include; elimination of
condensation, improved shock absorption, and improved heat transmission (factor of 8).
We have also undertaken successful internal bonding (free air exclusion) for applications where intrinsically safe equipment is required.
The production takes place at our head office facility in Munich, and avoids timely and expensive freight costs to Asia. We also have a second bonding plant at our NY facility to support the US market.
Subject to acceptance display / filter we are able to bond samples within 2 weeks via a hand built proto jig and if the solution requires displays we do not supply, we will also bond free issued components.
n the world of panel building, there is often the requirement for a low cost, compact enclosure that can be easily fitted – sometimes during the latter stages of manufacturing to accommodate design modifications - to house a small circuit board or similar electronic assembly.
DIN mounting PCB housings I
Available from Switchtec,
Euroclamp’s CEM series modular DIN rail enclosures provide just the solution.
contractors, and distributors the important application areas for the enclosures include lighting controllers,
Aimed at OEMs, equipment and component manufacturers, sub- circuit protection,
energy management systems, power supplies, and HVAC controls. Available in three sizes, 17.5, 22, and 35mm, the enclosures are supplied as three sub components; the main body, the top cover and the bottom mount that is furnished with two DIN rail clips, enabling quick and easy installation and removal from DIN rails.
Switchtec Ltd Tel: 01785 818600 Web:
www.switchtec.co.uk
First in-process temperature profiling system for PV anti-reflective coating
orking with suppliers to the solar and photovoltaic (PV) industry, Datapaq has designed the first solution in the market for monitoring the temperature of PV cells throughout the anti-reflective coating process. The SolarPaq system passes through the process chambers along with the products, taking accurate readings even with the plasma activated. This enables operators to optimize the coating process and, hence, cell efficiency. Measuring merely 18 mm in height, with a 146 mm square footprint, the application-tailored logger and thermal protection fit into a standard cell carrier, allowing production to go on without disruption. The VB7400 thermal barrier features a unique reflective plate insulation technology that precludes outgassing in vacuum processes and withstands the harsh thermal and electrical environments within the plasma chamber.
W DATAPAQ Tel: +49 30 / 47 80 08 - 412 Web:
www.datapaq.com / ELECTRONICS enter 809 enter 808
The process fits well with the latest technology of Projective Capacitive (PCAP) touchscreens which allows for a complete bespoke flat edge to edge cover glass (the iPAD look) This coverglass can be ceramic rear printed with logos, and shaped according to the requirement.
This
solution involves minimal set up costs and no min order qty’s.
The bonding also works well with other touchscreen technologies including surface capacitive, and resistive.
If using a non-touch
filter, we are successfully bonding with Guerrilla glass, ITO and mesh EMC filters.
Display Technology Ltd
Tel: 01634 672755 Web:
www.displaytechnology.co.uk
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Leading gallium nitride developer GaN Systems
signs exclusive worldwide deal with Mouser Electronics
aN Systems Inc, a leading developer of gallium nitride power switching semiconductors, today announced it is has signed an exclusive worldwide distribution agreement with Mouser Electronics. GaN Systems’ gallium nitride power transistors are based on its proprietary Island Technology® and offer significant advantages over traditional silicon MOSFETs and IGBTs to bring smaller, lighter and more efficient power electronics to numerous applications including consumer appliances, data center server racks, heavy-duty battery-operated power tools, notebook travel adaptors and many others. GaN Systems’ Island Technology® IP incorporates the wide-bandgap and superior switching speed, temperature, voltage and current performance of gallium nitride into a unique structure that maximizes wafer yields and produces highly efficient transistors up to four times smaller and at lower cost than tradition design approaches.
G
GaN Systems Tel: +1 (613) 686-1996 Web:
www.gansystems.com
enter 810 ELECTRONICS | SEPTEMBER 2014 27
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