Interconnection I Product News
Cambridge Connectors unveils low profile connector for high speed, low definition ports
Cambridge Connectors has launched a low profile 6GHz 75 ohm dual port DIN 1.0/2.3 connector that is suitable for high speed, high definition ports for applications such as 6G SDI Broadcast and CoaXPress Machine Vision. The design of this low profile dual port connector enables an enhanced packing density of connections on a standard PCI Express card and this has been made possible by combining the small format of DIN 1.0/2.3 style connectors with a unique diagonal mounting style. Meeting SMPTE 424m standards these connectors have maximum reflection factors (VSWR) of 1.13 (DC-3.0 GHz) and 1.29 (3.0 GHz-6.0 GHz). Compatible with standard DIN 1.0/2.3 connectors, they come with a robust push/pull latching system which provides a secure, reliable interconnection. This makes it
New design of Binder M12 panel mount connectors provides high levels of EMC
Binder has introduced a new range of panel mount connectors to its extensive, M12, A- coded products that incorporates a shielding sheet that transfers the screen from the connector body to the PCB thus providing a high level of EMC.
suitable for use in high density wiring environments where space is at premium and access can be limited. Typical applications include UHD Video
Broadcast, Process Control and CoaXPress Machine Vision.
Cambridge Connectors |
www.cambridgeconnectors.com
Deutsch Autosport high current connectors support hybrid systems
TE Connectivity (TE) has announced the launch of its new DEUTSCH Autosport Heavy Duty (ASHD) 3-Way Connector. The connector has been designed for the growing hybrid market in motorsports, in which racecars use three-phase motor/generator systems. "With the wider use of hybrid systems in motorsports, we were able to address the need for a motorsport-specific 3-way ASHD connector to complement the rest of the ASHD product range," said Paul Webb, product manager, Autosport, TE Connectivity. "The ASHD connectors help allow high-current applications to be used safely and reliably on modern racecars requiring hybrid technology." To ease application in three-phase motor/generator systems, the ASHD 3-way connector fills the gap between existing ASHD 2- and 4-way connectors and uses the same shell. The connector has three 4 AWG power contacts
Likely to be used in all types of control, automation, sensing and instrumentation equipment, the sheet allows the connector to be orientated at a variety of angles to simplify assembly. These new connectors are available with 4, 5, 8 and 12 gold plated dip-solder contacts in male and female format and in straight and right angle versions. A connector body made from nickel-plated brass, gold-plated brass male contacts and bronze female contacts provide a life in excess of
100 mating cycles and protection is to IP67 when mated.
Binder UK |
www.binder-connector.co.uk
Innovative PC board connector solution for optimum space utilization in devices
Designed for small-sized and flat-designed devices in building automation, Metz Connect has developed a spring clamp terminal block with compression-mount contact technology. As devices become smaller and flatter so the available space on the PC board is becoming more and more limited - as a result the connection technology requirements increase. Especially the permanently growing and more diversified market for building automation which makes complex demands on the PC board connection technology of automation components and where the focus lies on integration, migration, miniaturisation and reliability.
The new spring clamp terminal blocks with
with 200 A current-handling capacity and two data contacts for safety loop solutions to help allow safe handling. The new connector will also accommodate 16 mm2, 25 mm2 and 35 mm2 wire diameters.
DEUTSCH |
www.deutsch.net
Molex debuts Impel high-speed, high- performance backplane connector system
Molex Incorporated has unveiled the Impel backplane connector system which is available for use with its Backplane Pin Map Configurator. This 'future-proof' connector solution provides equipment manufacturers with the ability to have systems operate at today's data-rates and costs, while providing a migration path for enhancements in the same chassis through Impel daughtercard options.
The Impel connector system delivers low cross- talk and high density performance with data-rates up to 40 Gbps for next-generation backplane interconnect solutions. Because it meets all critical architectural needs, including conventional, co- planar, orthogonal midplane and orthogonal direct, it is suitable for telecommunications and data networking applications. "With many of our customers designing new multi-generation system architectures that include multiple data rate increases over time, our goal was to develop a highly flexible, high-performance connector solution," said Zach Bradford, new product development manager, Molex. "The Impel connector system provides the footprint and interface that allows users to migrate more easily and cost effectively to faster data rates without having to completely redesign their architecture or replace existing data centre hardware." The Impel conventional connector orientation, with a right angle daughtercard mating to a vertical header, provides 2 to 6 pair options to support price and performance. The 1.90mm conventional solution supports 80 differential pairs per linear inch and the 3.00mm conventional solution enables quad-route capabilities and a
38 September 2014
lower PCB layer count. In these same configurations, the Impel connector system enables co-planar solutions, which support right angle daughtercard mating to right angle headers for added system scalability. The Impel backplane connector solutions for orthogonal architectures allow for 3 to 6 pair configurations, scaling from 18 to 72 differential pairs per node. Featuring a third generation design, the Impel connector system also provides direct connection of PCBs in an orthogonal orientation to shorten system channel lengths, improve signal integrity channel performance, support open air-flow design and reduce applied cost. To help customers narrow down the exact
products they need, Molex is offering a Backplane Pin Map Configurator. The tool, available from the Molex website, guides users through a series of inputs to identify backplane parameters and quickly generate a pin map for their backplane application, helping shorten time-to-market and improve overall backplane design and performance.
Molex Incorporated |
www.molex.com Components in Electronics
compression-mount technology from Metz are suitable for compact, sandwich-type wall- mounted or flush-mounted devices. Contact of the PC board is established by self-cleaning spring contacts directly on the contact pads of the PC board provided for this purpose, which can be coated in accordance with the requirements. To establish contact, it is sufficient to lock the terminal block into place in the lower part of the housing and to assemble the two housing parts.
The integrated contact system of the terminal
block provides advantages in design compared to the usual pluggable spring clamp terminal blocks – they allow wall-mounted devices to be designed with lower height. Furthermore, through-holes and PC board
drillings are not necessary – as a result, the opposite side of the PC board offers additional space for more electronic components. This allows the size of the PC board and thus the overall size of the device itself to be reduced further.
The push-in technique makes for easy connection. The spring contact adapts automatically to the conductor, which guarantees connection reliability and makes readjustment of the terminal block unnecessary (maintenance-free).
The spring clamp terminal block with
compression-mount contacts is available in a grid spacing of 5.00 mm as pluggable and solderable version with a 90° connection direction in various pole numbers. They are thus suitable for wire-to- board and board-to-board applications.
Metz Connect |
www.metz-connect.com
GCT launches re-engineered Nano SIM connector
Following customer feedback Global Connector Technology (GCT) is launching the re-engineered SIM8050 Nano SIM connector, which at 10.8mm x 12.20mm has the smallest footprint of any push-pull connector on the market. The product has evolved to include a protective full metal shell and a height reduction to 1.35mm. Improved card insertion and extraction allows for a better user experience, whilst maintaining excellent vibration and shock characteristics. The Nano SIM socket accepts the 4th form factor Nano SIM card format. This format measures 12.3mm (L) x 8.8mm (W) x 0.67mm (T) and maintains existing SIM contact arrangements while reducing insulator size and thickness versus Micro SIM cards. Nano-SIM cards are approximately 15% percent slimmer than 0.76mm thick Mini and Micro SIM cards. SIM8050 is a push-pull connector with 6 contacts and 1.35mm height above the PCB. Measuring just 10.8mm x 11.0mm, a full metal shell protects the Nano SIM card. The connector is suitable for 5,000 card insertion cycles, while a card stop function prevents mis-orientation
during card insertion. Plastic pegs and SMT hold- downs offer accurate PCB placement and PCB retention strength. To speed up design downloadable drawings, 3D models and specification are available from the GCT website.
Global Connector Technology |
www.gct.co.uk
www.cieonline.co.uk
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