PHOTONICS ROADMAP PROJECTS AWARDED $1M GRANTS TO BOOST US MANUFACTURING


Two photonics institutes have been awarded around $500,000 each by the National Institute of Standards and Technology’s Advanced Manufacturing Technology Consortia programme (AMTech) in order to strengthen US manufacturing. The University of Rochester’s Center for


Emerging and Innovative Sciences (CEIS) and the International Electronics Manufacturing Initiative (iNEMI) were among the 19 grant winners, with CEIS given funding to lead the development of a national roadmap for photonics, while iNEMI is addressing hardware challenges of integrated photonics manufacturing. NIST announced $9 million in awards for


industry-driven consortia ‘to develop technology roadmaps aimed at strengthening US manufacturing and innovation performance across industries’. CEIS will work with its partners and with the


National Photonics Initiative (NPI) to forecast the introduction of new technologies and identify manufacturing challenges – which, if solved, can help to strengthen the competitiveness of


domestic photonics companies and also to expand photonics manufacturing to the United States. The US has been the world leader in


developing photonics technologies, including fibre optics, lasers, digital imaging and flat panel displays. However, the US’s share of photonics


manufacturing has dropped to less than 10 per cent of photonics components sold worldwide. The CEIS roadmap will identify key priorities and lay out a plan for addressing this. ‘The roadmap will address critical gaps to


increase our nation’s [USA] competitiveness in photonics manufacturing,’ said Robert Clark, senior vice president for research at the University of Rochester and dean of the Hajim School of Engineering and Applied Sciences. Meanwhile, the Consortium for Integrated


Photonic Systems Manufacturing (CIPSM), led by iNEMI, will also put together a roadmap, in this case to address the technology gaps and challenges that are limiting the advance of hardware technology for use in integrated photonic system manufacturing.


Laser system keeps solar cell throughput high


3D-Micromac has supplied a laser system to Hanwha Q Cells for removing backside passivation on PERC cells. The Microstruct OTF laser system creates a selective opening of backside passivated multi- and mono-crystalline solar cells, thereby achieving a throughput of 3,600 wafers an hour. The laser processing is realised


during the continuous transport of the cells under the laser source,


whereby the relative motion of the cells is automatically compensated for. Stops for the positioning of the individual cells are completely eliminated. The handling of the solar wafers is contactless so the wafer surface remains unaffected. This ensures a gentle and frictionless transport of the wafers and also means cell breakage or micro cracks are reduced, so a higher yield is achieved.


‘We are delighted that Hanwha Q


Cells will further develop its Q. Antum cell technology manufacturing processes (PERC process) using 3D-Micromac equipment. This shows that our strategy of supporting cell manufacturers with our process know-how in the implementation and development of new cell technologies is paying off,’ stated Tino Petsch, 3D-Micromac CEO.


LZH develops glass welding process


Scientists of the Glass Group at the Laser Zentrum Hannover (LZH) have developed a process for laser-based joining of borosilicate and quartz glass. Complex glass parts are, in most cases,


manufactured manually by a glass apparatus maker using a gas flame. Since the process cannot be entirely controlled, the quality fluctuates. LZH’s process includes integrated temperature control that regulates the viscosity of the parts in a pre-defined way during the welding process. The process uses a CO2


laser beam to provide the required amount of heat energy. The www.lasersystemseurope.com | @lasersystemsmag


temperature is measured without contact using a pyrometer. In order to bridge gaps at, for example, L angle


geometries, glass powder is added as filler material during the joining process. In doing so, the glass powder is melted and forms a homogeneous welding seam with a constant bead height. The new process set-up enables automated joining of glass in various welding configurations, such as butt joints, fillet joints and L-angles. The project was supported by the German Federation of Industrial Research Associations.


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