LASYS
production environments. Besides massive R&D activities to improve and stabilise the technology Renishaw also set up the ‘turnkey strategy’. Tis strategy offers the full range of customer care up to the customer-owned additive manufacturing process. In detail Renishaw offers consultancy, machine technology, training, job order production and finally the full process chain to reach the highest part quality and profitability.
www.renishaw.de
SLM in micro scale (SLµM) – challenges and applications
Ronny Hagemann, Laser Zentrum Hannover
Selective laser micro melting (SLµM) is an additive manufacturing procedure that allows the
reproducible production of 3D parts in micro scale using special alloys containing platinum, titanium and nickel that are commonly used
the variety of toxic gases or particles is widespread as well. Tough there are secure filtration possibilities, the filter needs to be designed according to the process used. An ultrashort pulse process asks for a different solution from a continuous wave laser treatment. Beside the filtration, the acquisition of the fume is of similar importance. Effects of thermal and kinetic energy as well as particle size will be analysed and appropriate capturing solutions are emphasised.
www.ult.com
14.00-14.30
Mobile system for laser hardening Eckehard Hensel, ALOtec
in biomedical sector. Following the special rules of additive manufacturing in micro scale, using suitable soſtware and process equipment as well as adjusted parameters are essential to achieve a high spatial resolution of less than 50µm, accurate surface topographies and usable functional material properties. A summarising overview of currently achieved results, challenges and potential applications will be presented.
www.lzh.de
13.30-14.00
Challenges in laser fume acquisition and filtration
Dr Stefan Jakschik, ULT
Laser fumes are a very critical component of laser safety considerations. Te fumes are generated while processing metals, organic materials or plastics by means of laser energy. Because of the many different laser processes,
18 LASER SYSTEMS EUROPE ISSUE 23 • SUMMER 2014
Hardening of machine components and tools is used to increase the strength and the wear resistance. A disctinction is made between hardening processes acting on the whole component, such as common curing in a furnace and plasma nitriding, and those processes only acting locally, such as laser hardening. Laser technology allows the partial hardening of arbitrary contours as well as specific points. Basic strength in the material core remains. Te crawler chassis can ensure the laser hardening system goes directly to a large and heavy component. Tis means moving heavy components is no longer necessary.
www.alotec.de
14.30-15.00
Latest developments in large area laser cladding with direct diode lasers
Heiko Riedelsberger, Coherent
Large area heat treating and high deposition rate cladding are two applications particularly suited to direct diode lasers. Both are
power-intensive applications, where diode lasers excel due to their electro-optical efficiency around 50 per cent, compared to 12 to 15 per cent for CO2
lasers. Both require rapid heating of large metal surfaces close to their melting points (heat treating), or even beyond (cladding). Processing speed is thus directly related to available laser power. In the past 1 to 4kW systems have been used for these applications typically. Tis presentation will focus on applications and performance achieved with direct diode lasers delivering up to 10kW of power, and using some innovative tools developed for its versatile use.
www.coherent.com
15.00-15.30
Advances in UV laser micro material processing
Scott White, Spectra Physics
and 30 per cent for fibre
Ultraviolet (UV) lasers are leading a new age in micromachining, first by displacing more traditional IR lasers and now enabling applications previously deemed unachievable. Te shorter wavelengths provide advantages of tighter focus and unique material interaction, and advances in UV laser power and pulse width/shape manipulation now make it commercially practical to capitalise on these attributes at the productivity rates required for today’s microelectronics devices. Tis presentation will highlight some of the latest application advances for UV lasers such as strengthened glass cutting for mobile devices (see image), PCB drilling, and metal and ceramics processing for PWBs and electronics packaging.
www.spectra-physics.com
15.30-16.00
System integration and benefits of beam shaping optics
Ulrich Rädel, Topag Lasertechnik
Beam shaping optics help to optimise results in laser material processing. Process adapted
@lasersystemsmag |
www.lasersystemseurope.com
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