Enclosures & Interconnection I Product News
Molex first-to-market with LED array plastic interconnection technology
Molex Incorporated has unveiled a new development in LED array holder technology which provides integral electrical, mechanical and optical connectivity and helps to simplify design integration for lighting manufacturers. Existing LED arrays are a compromise between the LED array metal printed circuit boards or ceramic substrates being small enough to minimise costs and deliver the optical performance required while also providing electrical, mechanical and optical attach features to make them easier to use in a lighting system. The new technology from Molex transfers the connectivity from the LED array metal or ceramic substrate to a separate plastic body substrate, allowing for improvements in thermal, optical and mechanical interconnect functionality. This plastic body substrate can be combined with the LED array package in a number of ways to provide an array top side surface with multiple connection choices. This new technology, co-developed with Bridgelux, has been incorporated into the recently announced Vero array product family from Bridgelux. The interconnect technology is expected to make future LED array products easier to integrate and more cost effective, enabling lighting OEMs to reduce system costs, decrease time to market and improve the reliability of LED luminaires. These advances include thermally isolated solder pads, an integral Molex Pico-EZmate header, and improved mechanical attach and optical reference features, all while maintaining a very low profile. The solder pads are designed to make direct soldering easier and more robust than soldering to current array packages made
Radiall expands SMP range with new SMP- LOCK connectors
Radiall, a supplier of RF connectors and interconnect devices has expanded its broad range of SMP products with new SMP-LOCK connectors that feature a robust locking mechanism, which dramatically increases the retention force of the interface and prevents accidental disconnection. Offered with a limited number of receptacles and straight or right-angle plugs for standard cables, the SMP-LOCK connectors can be customised to fit preferred cable types or to meet the needs of specific microwave modules. They have been specially designed for harsh environments and to withstand severe vibration and drop tests.
of materials such as aluminium or ceramics. The Pico-EZmate connector header option enables a solder free electrical interface and options for field service and replacement. According to Jim Miller, chief sales and marketing officer at Bridgelux, “This interconnect technology simplifies many of our customers’ immediate system integration problems, and will help usher in the era of smart lighting systems. We know that in the not too distant future we will see convergence occur in solid state lighting, just as it has with consumer electronics. That convergence will require additional functionality, sensors, communications, and other features incorporated into the LED light engine. This advanced platform technology is well suited to enable convergence through its new product architecture.”
The plastic body, interconnect technology builds on technology from Molex that is used in consumer electronics and other high volume markets.
Molex Incorporated |
www.molex.com
The connectors are suitable for cable-to-cable or cable-to-module interconnections inside equipment subject to harsh mechanical stress such as airborne radars, avionics, satellites,
Murrelektronik redesigns its M8 connectors
Murrelektronik have redesigned their M8 connector range. Now not only does it have a new, modern look but it has also been technically upgraded. The range of available shielded M8 connectors has also been significantly increased. The connectors are moulded with PUR - ensuring high resistance. Gold-plated contacts, very small dimensions, a connection for corrugated pipes and a hexagonal screw with thread (SW9) are additional new features. Murrelektronik is also able to offer a wide
Case Study - Customisation as standard
Design engineers are being pushed to design more aesthetically pleasing product which can be differentiated from the competition. As a result they are facing a situation where a standard, off the shelf enclosure is no longer suitable. In large volume products a custom enclosure
can be realised through the design and production of a custom mould tool - the pay back of the cost can be realised in a relatively short timescale. However in low to medium volume products the options to invest in the necessary mould tools for a custom enclosure is neither practical nor financially viable, as a result a degree of customisation of a standard off the shelf enclosure is often required through machining, drilling and/or printing. Often carried out by a third party this can lead to a substantial hike in costs, longer lead times and is often associated with large minimum order quantities. While the customisation process can be carried out internally this can require substantial allocation of internal resources. Hitaltech is currently suppling enclosures into the building automation market. Within this market both energy management technologies and light management are registering strong growth rates and manufacturers are striving to design a product which can be differentiated from the competition - both
functionally and aesthetically. As a result a trend has emerged over recent years where a growing number of customers within this market are finding themselves in a trade off situation between customisation costs and the need to set themselves apart from their competitors. In response Hitaltech and their manufacturing partner
24 April 2013 Components in Electronics
Italtronic have worked together to offer a range of DIN Rail enclosures which suit a variety of applications as standard, as well as offering the option to customise the product to meet specific demands. A two option approach has been developed which gives design engineers the possibility to differentiate their product for both low and medium volumes with an excellent value to cost ratio, and without the need to invest in expensive tooling and processes.
The first of these options is aimed at low volume projects with typical annual quantities from one to three thousand pieces. Using a combination of high tech multiple tools, multiple axis CNC machines as well as low cost high quality laser and full colour digital printing processes, Hitaltech can offer an economic customised enclosure.
The second option is aimed at medium volumes with typical annual quantities from three thousand pieces. Using a multiple slide, flexible tooling approach Hitaltech’s partner Italtronic have developed a range of mould tools that can be adapted by the inclusion of relatively low cost custom mould tool inserts to produce a finished custom enclosure. This custom
enclosure is produced direct from the injection moulding process therefore eliminating the need for additional machining. This customisation approach was utilised by design engineers at Schneider Electric in the development of a new Remote Terminal Unit called the Talus T4e. Used in water and waste water treatment sites, environmental monitoring systems, abstraction points and booster pumping stations, the Talus T4e is housed in a Hitaltech standard DIN rail and wall mountable enclosure the 12M Modulbox. Whilst working with the engineers at Schneider Electric it became apparent that they required a DIN rail mounting enclosure to have large internal volume for components with openings for a large number of inputs and outputs as well as having both wall and DIN rail mounting capability. The projected annual quantities fell into the small to medium volume category and therefore the customer did not want to invest in custom mould tools but ideally wanted to receive the
enclosure already customised to their requirements allowing them to eliminate the need to sub contract out any machining or printing to a third party. Based on these requirements Hitaltech
proposed the Modulbox ‘C’ version. This version boasts two high shoulders compared to the traditional two step design, resulting in the advantage of increased internal volume giving more room for components and air flow. As well as requiring custom openings for components, the customer also required laser markings on the enclosure and a digitally printed transparent top panel. The resulting finished product is housed in an enclosure which looks aesthetically pleasing and gives a distinct customised look meeting both functional and aesthetical requirements.
As well as the Modulbox range, Hitaltech
offer other DIN Rail mounting enclosures and a large range of hand held enclosures.
Hitaltech |
www.hitaltech.com www.cieonline.co.uk
variety of models: male or female, straight and 90°, 3-pole and 4-pole, shielded and unshielded, various colours and materials, connection cables, open ended wires, add in T-couplers, adapters and models with LED.
Murrelektronik |
www.murrelektronik.co.uk
missile, and UAV and UGV applications. For high- density PCB or panel layouts, an extraction tool is available to ease the connect/disconnect operations. SMP-LOCK plugs are compatible with most standard SMP receptacles in the unlocked position, with the exception of catcher’s mitt type.
The addition of a locking mechanism to the SMP interface makes it less vulnerable to the most demanding vibration and shock requirements. The retention force of the connector when locked is specified at 450N with .085’ semi-rigid cable. The actual force required to break apart male and female connectors when locked is extremely high and has been measured at 1500 N.
Radiall |
www.radiall.com
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