INTERCONNECT
New space saving push-push Micro SIM connector from TE
The new ultra-low profile push-push Micro SIM connector saves up to 50 percent more space on a PCB than previous generation SIM Connectors. This Micro SIM connector prevents incorrect card insertion and features a unique dual slanted contact pin design. Suitable for mobile devices, home entertainment, security systems, POS scanners and anywhere data is kept and stored on a network.
appliCations » Ultrabooks
» Localization devices / Trackers » Servers
» Intelligent Metering » Personal GPS
Key benefits » Low profile design allows for up to 50% of space savings on a PCB
» Push-push function allows for easy SIM card ejection by the connector itself to benefit the end customer
» Card detection switch secures circuit design » Dual slanted contacts provide strong mating force and avoid contact jam
» Dual contact design allows for a better mating performance as well as providing a wider tolerance between the card and stopper
For more information visit
avnet-abacus.eu/te PASSIVE
FX20 Series, 0.5mm Pitch, Floating, Board to Board Connectors
The FX20 series has been introduced to meet the demand for floating connectors that can absorb mounting misalignment in applications where multiple stacking connectors are used.
The header connector has a unique floating structure embedded inside the fixed base of the housing. This allows alignment movement in XY directions of + 0.6mm minimum to absorb mounting misalignment, vibration and dimensional errors. Large mating guides are present on each side of the connector to allow easy mating and self alignment movement of + 1.2mm in XY directions. These also prevent reverse insertion. The receptacle features highly reliable
double beam contacts. Each contact beam has a different vibration characteristic due to different contact forces that widens the frequency range to avoid resonance. This allows high vibration resistance and increased
board connector series shares the same stack height variants as FX20, therefore both can be combined on the same PCB to offer a high speed and high current capability.
Ideal applications are industrial equipment, broadcast equipment, smart meters, medical devices, BTS, measuring instruments and projectors.
contact reliability. Furthermore the first beam contact has a self-cleaning function which eliminates dust from the contact path of the second beam contact. Despite the fine pitch of 0.5mm, each contact has the current handling capacity of 0.5A.
The contact area is protected from solder wicking and penetration of flux due to the clearance between the contact and housing to prevent capillary action. The PCB layout design allows PCB patterning underneath the connector for design flexibility.
Hirose’s popular FX18 high speed, board to 5 focus magazine - issue 14
Key features » 40, 60, 80,100,120 & 140 contact positions » 0.5A current rating » 0.5mm pitch » High contact reliability » Stack heights 15, 20, 25 & 30mm » 50V voltage rating
For more information visit
avnet-abacus.eu/hirose
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