from start to fi nish. Dipping times for removal of plating, and for re-tinning average about 2 seconds for each row of leads. Also, fl ux is applied through a dipping
process to ensure uniform application and thorough fl uxing for proper wetting. One wants enough fl ux to achieve the objective without applying excess and creating a cleaning issue. Thus, the process, from removal of the component
from the tray, through fl uxing, preheating, dipping, visual inspection, followed by post-cleaning and washing, drying, inspecting, and put back in the carrier that it came from, should be completely automated. Visual inspection mid-process is to ensure the absence of bridging, a real potential problem when tinning fi ne-pitch components such as QFPs. This is why the tinning process requires pre-heating, at a controlled temperature ramp to a desired set -point, especially important with ceramic components,
prior to both the ‘removal’ dip and the ‘re-tinning’ dip. The preheating also minimizes any potential for thermal shock or damage at the lead/body interface. Depending on what material is being removed, the level
of contamination in the ‘sacrifi cial’ pot must be monitored, and it must be exchanged for a fresh pot when the level of gold or unwanted metal reaches a certain saturation point.
For Further Information On This Process Contact: Alan Cable, President, A.C.E. Production Technologies, 3010 N. First St., Spokane Valley, WA 99216
www.ace-protech.com
SMT Cable Clips
Harwin's range of SMT wire management clips is now available in 4 sizes and offers a ground
for coaxial cable. Auto-placed and soldered directly to the PCB these clips reduce process costs and eliminate through holes.
Samples available at
www.harwin.com/ez-cable_clips
P I C K & P L A C E R E A D Y B Y D E S I G N For Distributors visit
www.harwin.com/contact/distributors January 14th 2012
www.electronicscomponentsworld.com /
www.electronicsproductionworld.com EIU 21
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