NEWS // FEATURES // NEW PRODUCTS How much strain can a package take?
Spherical Bend Tests within IPC/ JEDEC-9707 can reduce Mechanical Failures. Manufacturing processes, handling
and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more diffi cult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation. “Spherical bend puts the most
stress on a ball grid array’s (BGAs) corner interconnects,” said Aileen
Allen, a reliability engineer at Hewlett- Packard and member of the IPC 6-10d SMT Attachment Reliability Test Methods Task Group that led the effort to develop the standard. “The aim of this test methodology is to impose the worst-case bend mode that the package may see in the fi eld and to determine strain limits that envelope any bend modes that could be seen during manufacturing, assembly or test.” The test methodology calls for
eight points of contact arranged in a circular pattern. A PCA with a single BGA in the center of the printed board is placed component side down onto the support pins, and load is applied on the backside of the BGA. Strain
gages are placed adjacent to the component per the recommended gage placement. The PCA is defl ected to strain levels of interest, and failure analysis is performed to determine the degree of damage induced by fl exing to these strain levels. An iterative approach is used to determine the strain at which no damage is incurred, which is the strain limit. “These strain limits can then be used in the fi eld to reduce reliability risk by ensuring strain on products do not exceed these limits,” added Allen. IPC members may purchase the standard for $36. The standard industry price is $72. For more information or to purchase IPC/ JEDEC-9707, visit
www.ipc.org/9707.
Rutronik and Murata expand franchise across Europe
Rutronik Elektronische Bauelemente GmbH is now distributing Murata active and passive components as well as components produced by Murata Power Solutions throughout Europe. Before now, the
cooperation between the two companies had been limited to central Europe, France, Denmark and Eastern Europe. “We are delighted to announce that we now represent one of our most important partners in the passive sector as well as a technology and market leader in high cap MLCCs, resonators and inductors across Europe,” says Markus Zühlke, Marketing Director Passive Components at Rutronik. “We are confi dent that this step will enable us to achieve disproportionate growth,
10 EIU
thereby further increasing our strong market share in passive components.” For this purpose, the distributor has also reinforced its design-in activities and is further expanding its product range – In the future it will also distribute products manufactured by Murata Power Solutions. These include DC/DC
modules, complete power supply units, digital displays as well as coil ware and ballast units. “Murata is also one of the market leaders in the fi eld of power modules. This expanded franchise means that, in the future, Murata will play a key role in both Rutronik’s passive and semiconductor divisions,” explains Thomas Ulinski, Marketing Director Semiconductors at Rutronik.
In addition to MPS, the semiconductor products also include sensors, wireless products and protection devices. Murata’s primary products comprise
ceramic capacitors and resonators, inductors, piezo-electric components, as well as Murata Power Solutions products for the automotive, industrial, home appliance, lighting, medical and alternative energy target markets. “Our focus markets coincide precisely with those of Rutronik,” comments Thomas Altmann, Distribution Manager at Murata Elektronik GmbH. “This means that Rutronik has exactly the right kind of technical expertise required to acquire important design-in projects – specially in the industrial sector. Its strong presence and the international range of Rutronik’s distribution organisation will also help us to further expand our market position in Europe.”
www.rutronik.com
www.electronicscomponentsworld.com /
www.electronicsproductionworld.com
January 14th
2012
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40