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Automotive Electronics


New V-FT series - low ESR SMD Aluminium Electrolytic Capacitor Series


unauthorised manipulation from outside because the encoding keys are managed in the hardware.


All of the graphics processing and


therefore the more computer-intensive part of the application is processed with the System-on-Chip (SoC) of the MB86R1x ‘Emerald’ family. Depending on the performance required, the core of the graphics module is formed by either the MB86R11 ‘Emerald-L’ for the hybrid system or the MB86R12 ‘Emerald-P’ for the programmable instrument. Each ‘Emerald’ version basically combines an ARM Cortex-A9 processor, together with an ARM Neon SIMD engine, an image processor and two standalone graphics processors on one chip. The profile also features parallel video inputs and display outputs, automotive network connections and various interfaces. Optimised chip architecture ensures that generated camera images and graphics are overlaid and blended without affecting each other’s performance.


The component is equipped with four separate parallel video inputs which support the RGB888 and ITU601/656 formats. One of these channels also enables serial video transmission via APIX2. The colour, contrast and brightness of the imported video images, even in sub-areas, can be individually adjusted using the image processor. To take the burden off the main


processor, the ‘Emerald’ family provides two separate graphics processors. In the central 3D graphics processing unit, the vertex and shadow fader can be programmed with ‘OpenGL ES 2.0 Shading Language’. To isolate the rendering process, a separate central 2D graphics processing unit is provided. Supported by multilayer technology at the display output, this flexible chip architecture also enables graphics with different image refresh rates and resolutions to be displayed at the same time. The advantages can be demonstrated with a typical programmable instrument cluster application. To display traditional round instruments such as the tachometer and rev counter, a refresh rate of 60 frames per second (fps) is required. Traditionally, these dials are displayed in combination with a 3D vehicle model or navigation map. 30 fps is quite sufficient for this information in the central area. The generation of scales and dials is isolated from the central application and executed separately by the two graphics engines.


www.cieonline.co.uk


The layer method now means that separate memory areas can be allocated to the pointers and vehicle model or map, which are generated with different image refresh rates and finally superimposed and blended to form a single image. The ability to supply fluid and realistic animation is a key advantage of the ‘Emerald’ architecture and can be fulfilled without the maximum image refresh rate being required for the whole image content. In each scene, the instruments can be rendered with 60 fps, even if other content is being displayed in parallel, which often requires different levels of computing performance.


Another useful advantage of the layer method is when the same image content appears on more than one display. In this case, the graphics are rendered once only and can be allocated to different displays. This family of components has three parallel display outputs, two of which support this multilayer concept with up to eight layers. The single-layer concept is supported by one of the display outputs. Each of these outputs has its own register set and can therefore generate an individual timing for different resolutions. The ‘Emerald’ family is based on two conceptually identical basic components. At the entry level, there is the MB86R11 ‘Emerald-L’. For more demanding applications, the MB86R12 ‘Emerald-P’ provides the necessary system resources. The main differences lie in the


computing performance and the integrated interfaces. Compared with the entry-level version, the MB86R12 ‘Emerald-P’ has more than 30% additional computing power thanks to the higher clock frequencies. This component also includes a further four APIX2.0 interfaces from Inova Semiconductors. APIX is a serial-high speed interface that can transmit video data, control data and the power supply via the differential signal paths. This dual, scalable system concept combined with the ‘CGI-Studio’ authoring tool helps reduce both system and development costs. To expand the concept, you have the option of connecting four video cameras at the same time to create a 360° driver assistance system for both system versions.


Fujitsu Semiconductor Europe | www.fujitsu.eu


Components in Electronics September 2011 15


With the new V-FT series, Panasonic introduces the latest low ESR SMD Aluminium electrolytic capacitor. This product disposes of high capacitance and low resistance values combined with a small-sized case. The outstanding performance of the new V-FT series is achieved by high-capacity electrode foil and sophisticated Panasonic Low resistance technology.


Compared to the leading low ESR Panasonic series (V-FK and V-FP) and to comparable competitor products, the new V FT series is miniaturized by 1 case size with same CV values and Low resistance. The V-FT series corresponds to future market needs requesting high performance components in small size ratio. Less material contributes to higher environmental friendliness.


Features compared to V-FK series:


- Miniaturization & weight reduction = Down-sizing by up to 60% - Stable operation & high efficiency = ESR reduction down to 50% - Ripple current = Increase up to 1.4 times - High reliability & long lifetime = 2000h at 105°C - high temperature lead-free reflow soldering


Applications:


- Switching Power Supplies - DC/DC converter - Automotive equipment - Industrial electronics - Digital devices - Telecommunication, e.g.base stations - Smart Meter - New designs for high efficiency and miniaturisation


Technical Data: Voltage range


25 VDC to 50VDC


(6.3 VDC to 16VDC will be available from Q3 2011 onwards).


Capacitance range 10 uF to 820 uF


(10 uF to 2200 uF will be available from Q3 onwards)


Temperature range -55°C to +105°C Endurance Size


2000h at 105°C B to G case size (Ø4 to Ø10mm) Soldering


peak temperature 260°C (Ø4 to Ø6.3mm) / 245oC (Ø8 to 10mm)


For samples please order at Farnell = www.farnell.co,/ panasonic


For a datasheet = http://industrial.panasonic.com/www-data/ pdf/ABA0000/ABA0000CE135.pdf


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