11-05 :: May/June 2011

nanotimes

Companies Facts

ment Center (RMDC) at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, USA. http://www.fujifilm.com

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EO Specialty Chemicals, Inc. has entered into an agreement with BASF (BAS:GY) to acquire

the Bisomer monomer business (hydroxy metha- crylates, multifunctional methacrylates (MFM) and specialty adducts) and conventional contact lens business of Cognis UK. The transaction includes a manufacturing facility in Hythe, England that produ- ces hydroxy methacrylates, multifunctional metha- crylates (MFM) and specialty adducts, polyalkylene glycols (PAG) and PAG-based lubricants. As a part of the transaction, approximately 140 employees are expected to transfer to the new owner, GEO Special- ty Chemicals UK Limited. http://www.basf.com/

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arris & Harris (TINY): Research 2.0 published a report on Harris & Harris:

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eidelberg Instruments announced the instal- lation of a µPG101 at STMicroelectronics in

Agrate, Italy. The µPG101 is an extremely econo- mical and easy to use Micro Pattern Generator for direct write applications as well as low volume mask making. It is also perfectly suitable for rapid prototy- ping of 2D and 3D microstructures on substrates up to 4 inches by 4 inches, and is capable of exposing

Furthermore, imec announced the establishment of imec India in Bangalore, Karnataka, making a first step towards the Indian market with the signing of an R&D partnership agreement with Wipro Technolo- gies, the Global Information Technology, Consulting and Outsourcing business of Wipro Limited (NYSE:

high resolution designs with minimum features of 1 micron and an address grid of 40nm. http://www.himt.de

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mec announced their continued research arran- gement with Qualcomm Incorporated on 3D

technology which broadens the collaboration with Qualcomm participating in imec’s INSITE program focusing on designing with advanced technologies. This extended collaboration gives Qualcomm ear- ly insight on the system design impact of 3D and advanced process technologies including device structures, interconnects and lithography for the sub- 20nm node. Since 2008, Qualcomm has participated in the imec industrial affiliation program (IIAP) on 3D integration providing Qualcomm early access to new 3D technologies for its future wireless products.

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