10-10/11 :: October/November 2010

nanotimes Companies In summary, Pressurex®

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sensor film is now proven to be appropriate for characterizing the encapsulation of

microelectronic systems. Correct characterization of this process is essential for further quality and reliability improvements. The methods presented here allow developing and monitoring stress-minimized encapsulation processes. They provide a firm basis for enhancing the reliability of polymer encapsulated microelectronic and micro-electromechanical (MEMS) systems.

http://www.sensorprod.com http://www.izm.fraunhofer.de

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