CIE Sept09 P18-19:CIE Sept09 P22-23 07/09/2009 13:27 Page 19
Boards & Modules
shows Torex’s XCM517 device that type of integrated power management
combines two step-down DC-DC solution mentioned earlier in the
converters (XC9236) into a USP-12B01 article and illustrated in Figure 1. This
mould package. The XCM517 Series solution also allows for pattern circuit
delivers a high efficiency and reliable layout to be configured within the
power supply with up to 600mA package and each pin has its own
output current per channel. The MCM through-hole for improved heat BOTTLED
device features a built-in 0.42_ P- dissipation.
channel MOSFET and 0.52_ N-
channel MOSFET; all that is
required to create a full power AT SOURCE
management design are two
small 1.5_H (3MHz version) coils
and ceramic capacitors
connected externally. DO IT THE
Companion products can also
be combined into one MCM
package. The XCM519 series
MCM, for example, brings LEWMAX
together the synchronous step-
down XC9235/36 with a low
input voltage, ultra LDO
XC6601 voltage regulator. High WAY
efficiency can be achieved with
the DC-DC handling the
majority of the step-down from
the battery (VBatt) combined
with extremely high
Figure 3 : XCM517 - Two XC9235/36 Step-Down
We build our own
performance from the LDO.
DC-DC Converters in one USP-12B01 package
machines, we supply the
Also available in the space
saving, ultra small USP-12B01
chips and we program
package, the XCM519 requires the in house , saving you
minimum number of components to The power of MCM
build the complete power and the future
time and money.
management circuit – all that is MCM package solutions, whether it is
required is a small coil and ceramic of mould or glass epoxy substrate DEVICE
capacitors connected externally. package type, offer an array of space-
saving and cost reduction possibilities
PROGRAMMING
Custom glass epoxy for power management circuits.
package MCM Additional products are scheduled for
TAPE & REELING
The second MCM package type uses a launch in the coming months
glass epoxy substrate which makes it including an MCM that integrates a
possible to build up a custom circuit step-up DC-DC with a Schottky diode
LASER MARKING
within the package without being targeted specifically for LCD
constrained by individual chip size. As backlighting designs.
BUFFER
such, it is possible to create multi
power supply MCM solutions
Torex Semiconductor
STOCKING
consisting of more than four ICs as
|
www.torex-europe.com
well as combining ICs and discrete
Andy Scott is European Marketing
One of the largest and best
components together to create the
Manager for Torex Semiconductor
programming centres you’ve
never heard of. Established
IC
Epoxy Mould
17 years.
Wire (Au)
Diode 2
Diode 2 IC
Diode 1
MOSFET 1
Pad
Pin
Pattern Circuit Glass Epoxy Layer
(Through
Layout
MOSFET 2
Hole)
0116 212 2133
sales@lewmax.co.uk
www.lewmax.co.uk
Proud to be based in Britain.
TS16949 from December 2009
30 million programable parts capacity per annum
Top Bottom
Lewmax Programming Limited, Unit 1 Victoria Mills,
Figure 4 : Custom MCM Glass Epoxy Package Solution – USP-20A01 (4.3mm x
Fowke Street, Rothley, LE7 7PJ, UK
4.6mm x 0.8mm)
www.cieonline.co.uk Components in Electronics September 2009 19
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