CIE Sept09 P18-19:CIE Sept09 P22-23 07/09/2009 11:47 Page 18
Boards & Modules
Getting
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Andy Scott from Torex Semiconductor Europe describes how the company’s
latest space saving, multi chip module technology is meeting the demands
of future power management design needs
Schottky Diode 1
Schottky Diode 1
MCM IC
DC-DC
MOSFET 1
Equivalent MCM Layout
Conventional Layout
MOSFET 2
Figure 1 : Board Space Comparison – Torex’s custom MCM integrates the DC-DC IC, two MOSFETs and two Schottky Diodes
P
ower management companies are To demonstrate this shortened lead- associated with chip design, the R&D placement costs. All in all, it’s a win-
already supplying multi voltage time, Torex has already provided a fully costs involved with this kind of MCM win solution.
rail solutions in one package. functioning custom MCM solution design are greatly reduced as the silicon Based around its existing Ultra Small
Many of the existing solutions tend to sample in around 4 weeks – from the has already been tested and verified. Package (USP) technology (0.6mm max
be product type limited, packaging time the initial request had been Moreover, the MCM solution enables profile) which offers compact, low
multiple dual and triple LDO regulators received! Furthermore, we were able to the power engineer to reduce the profile packaging, Torex has developed
or dual buck switching regulators in get the product into full production external component count on the PCB two types of MCM specific packages, a
one module. Although these modules status in around 24 weeks, which is – this has a major impact on reducing mould package solution and a custom
offer significant space savings, the half the typical lead-time glass epoxy substrate package
required level of design flexibility for often quoted for comparable Mould Package solution.
engineers has been somewhat lacking. custom ICs.
IC 1
Now emerging on the market are Mould package MCM
Multi Chip Modules, or MCMs, which Integration – less is more
IC 2
The mould package type uses a
combine multiple ICs as well as ICs Integration reduces the USP package style specific to
and passive components in a single physical size of the solution MCMs. As each IC chip is placed
package. These solutions can help dramatically – by up to 40% on an individual tab within the
designers create the flexible and more in certain circumstances. For Front Tab 2 package, it is possible to put
cost-competitive power management instance, Figure 1 illustrates together a solution of 2~4 chips
design they require, while maximising how a dual channel step-up that are completely isolated from
board space. In high volume DC-DC controller and related
Front Tab 1
Isolation
each other. As such, it is possible
applications, for example, Torex has external components can be to create MCM USP mould
created custom MCMs that integrate integrated into an MCM, package solutions with as many
the complete power management thereby shrinking the whole
Mould Package
Wire (Au)
tabs and pins as are necessary for
circuitry into a single package. power circuitry into a board each individual IC’s functions.
Torex’s MCM solutions are space measuring only 30mm x One example of this style of
somewhat different to what’s available 25mm. A custom MCM package is shown in Figure 2. The
on the market and that is because they solution developed by Torex,
have the ability to tailor any housed in a tiny USP20A-01
IC
USP-12B01 package incorporates
two ICs and a total of 12 pins.
combination of ICs into one ultra package measuring just Also, since the pin pitch of the
small, space saving package. Because 4.6mm x 4.3mm, integrates USP-12B01 is only 0.4mm, the
the company uses production ICs and the DC-DC IC, two MOSFETs
existing technology, there is no need and two Schottky Diodes. All
Front Heat Pad
physical package size can be kept
as small as possible.
for the usual electrical testing that remains to be added Using this type of USP
evaluation, ensuring that system externally are the inductors, packaging technology it is
integration is not overly complicated. capacitors and resistors. possible to combine multiple
As a result, development lead-time is Additionally, in comparison Figure 2 : USP-12B01 Package – 2.8mm x 2.3mm x power management ICs in one
shortened dramatically. to the development costs 0.6mm (top view & profile) compact mould package. Figure 3
18 September 2009 Components in Electronics www.cieonline.co.uk
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