INTEROPERABILITY
“
Ethernet is the foundational technology that powers the internet and the cloud”
like co-packaged optics with the host to module management communication based on a two-wire interface. Tis specification is targeted at systems manufacturers, system integrators, network operators and suppliers of CMIS-compliant optical and copper modules. At the 2022 first-quarter meeting, OIF initiated
a project to create supplemental specifications for the CMIS for Form-factor Specific Hardware Management (FSHM). CMIS will be adopted to manage the future generation of small form-factor pluggable (SFP) 112, SFP-DD/SFP-DD112, and quad small form-factor pluggable (QSFP) 112. Currently, CMIS does not provide hardware management control for these form factors. OIF started another new project that will add
CMIS support for host to module link training. Tis project will provide an optional out-of-band, protocol-agnostic management mechanism for optimising link tuning and training. In June, OIF released the CMIS 5.2 IA, which
includes new features supporting a wide variety of form factors, most importantly fibre channel enhancements, expanding the range of end-user applications. Tis IA marks the first OIF-approved CMIS IA and the completion of the transition of the work to OIF. CMIS addresses commonality
OIF project highlights in 2022
in managing pluggable modules and is a critical interface working hand-in-hand with other OIF areas, including co-packaging and electrical. A new project launched in June will create the next version of CMIS by adding the necessary support for co-packaging/External Laser Small Form Factor Pluggable (ELSFP) projects. Tis work represents the next steps in the evolution of CMIS and its alignment with other OIF projects to enable an interoperable ecosystem.
CEI for the next generation Four new CEI projects were launched in March: CEI-224G-Extra Short Reach (XSR) Common Electrical On-Package IO Project, CEI-224G- Very Short Reach (VSR) Common Electrical Chip-to-Module IO Project, CEI-224G-Medium Reach (MR) Common Electrical Chip-to-Chip IO Project, and CEI-224G-Long Reach (LR)
Common Electrical Backplane and Copper Cable IO Project. Tese are the first set to target the 224G generation of electrical interfaces. In addition to these 224G project launches,
OIF published the 224G Framework Project white paper, which provides a roadmap for the applications, challenges and projects needed to support new specifications and technologies. Te four new projects will develop the IAs to address that roadmap. In June, OIF published a new IA for CEI 5.0
specifying the next generation of 112Gb/s electrical interconnects. Te IA specifies transmiter, receiver and channel requirements associated with extra short reach (XSR), medium reach (MR), and long reach (LR) interfaces for multi-chip-module, chip-to-chip, and high-speed backplane applications. Tis IA marks a new generation of specifications for 112G interfaces that enable applications including backplane, chip-to-chip, and die-to-die interfaces within a package. It also enables multiple applications, such as co-packaged optics. Multiple live CEI-112G demonstrations at
ECOC featured multi-party silicon supplier interoperability over various channels, including mated compliance boards, PCB channels, direct atach copper cable channels, a cabled backplane, and even fibre. Each configuration demonstrated the technical viability of 112 Gbps operation and multiple industry form factors, including OSFP and QSFP-DD. As the industry looks forward to higher data
rates and increased throughput for the next generation of systems based on 224Gb/s per lane, new specifications and technologies will be required. OIF unveiled the first live 224G demo at ECOC, proving it is leading on 224G hardware interconnection application spaces and definitions.
OIF’s multi-vendor interoperability demos at ECOC 2022 20
SDN API Planning for the next Transport SDN API Interoperability Demo continues. Te 2020
Fibre Yearbook 2023
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38
