INTEROPERABILITY
line interfaces for two applications: 1) 800ZR for amplified, single-span DWDM links up to 80-120km; and 2) 800LR for unamplified, fixed wavelength links of 2-10km. Both applications support Ethernet client(s) up to 800G aggregate bandwidth. Tink of 800ZR as 400ZR, only faster. Te goals for 800LR, which only supports 400 and 800, are to enable ultra-low-latency, low-power, low-complexity modules and create a new class of coherent interfaces suitable for the coming generation of data-centre-coherent optical interconnects.
Connecting with co-packaging Te Co-Packaging Framework IA project was initiated in late 2020 following virtual member- only and public workshops that explored and discussed key drivers and the significant constraints (electrical, thermal, optical and so on) related to co-packaged connectivity interoperation. Te initial projects started under the framework project’s umbrella include the 3.2T co-packaged module and the external laser small form factor pluggable (ELSFP) module. In February 2022, OIF released the Co-
Packaging Framework IA, which identifies the critical co-packaged applications and their requirements and charts a path for interoperability standards. Tis framework document aims
Fibre Yearbook 2023
to identify some essential applications and their requirements for which co-packaging implementations may provide significant benefits. While individual companies consider options
to optimise power and density, OIF has seen the need to lead industry standardisation discussions for co-packaging architectures, which promise to reduce power consumption and increase bandwidth edge density. OIF is leading the industry’s interoperability discussions for co-packaging solutions. At ECOC, it showcased its progress with multi-party demonstrations of its 3.2T Module project and External Laser Small Form Factor Pluggable project (ELSFP). A variety of interoperable components that enable co-packaging were shown, along with a system- level implementation.
Get to know CMIS Te Coherent – Common Management Interface Specification (C-CMIS) – project was launched in 2020 to create an IA as an extension to the CMIS specification, targeting DCO modules and DWDM functions. C-CMIS provides the management information for digital coherent optical (DCO) modules in form factors, including QSFP-DD, OSFP and COBO. Te document is focused on supporting the OIF 400ZR implementation agreement. Future versions will include more
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As the industry looks forward to higher data rates and increased throughput for the next generation of systems based on 224Gb/s per lane, new specifications and technologies will be required”
complex metro modules and may extend these management features to other form factors. In January 2022, OIF expanded its role in
driving industry interoperability through the addition of the Common Management Interface Specification (CMIS) work, originally initiated by the Quad Small Form Factor Pluggable Double Density (QSFP-DD) Multi-Source Agreement (MSA) and now transferred to OIF. CMIS may be used by pluggable or on-board modules, such as QSFP double density (QSFP-DD), OSFP, COBO, QSFP and future module developments,
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