Contents Regulars
04 Trend 05 Technology 08 Circuit Drill
By Sulaiman Algharbi Alsayed, Managing Director, Smart PCB Solutions
10 EMC
By design engineers, REO UK, and Dr Min Zhang, EMC consultant, Mach One Design
12 Optical Isolation
By Professor Murat Uzam, Department of Electrical and Electronics Engineering, Yozgat Bozok University, Turkey
Cover supplied by Microchip Technology. More on pages 6-7 Features
17 Where next, after 2G and 3G are phased out? By Paul Bullock, Group Head of Mobile Virtual Network Operations, Wireless Logic
20 Wireless protocols for industrial settings By Rolf Horn, Applications Engineer, Digi-Key Electronics
24 The components needed for successful 6G communications By Dr. Guillaume Ducournau, Professor and researcher in THz communications, Université de Lille, France
27 Antenna design for small IoT devices By Edoardo Genovese, Technical Development Manager RF – Europe, TTI
30 High reliability in demanding automotive applications with NAND Flash-based storage devices
By Silicon Motion design engineers
33 Novel materials for microelectronics off er better temperature control By Duncan Stacey, Sales and Marketing Director, Linkam Scientifi c Instruments
36 GPUs for faster image and video processing By Frans Vermeulen, Head of Sales and Marketing, Active Silicon
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November 2022 Volume 127 Issue 2022 £5.90
8-bit MCUs are smarter, safer and stronger than ever before
SPECIAL REPORTS • RF design
• Thermal management • System design • Communications
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