Technology
LEM unveils two new products to complete its IN family of current sensors
Electrical measurement technology specialist LEM has added two new members to its IN family of current sensors, suitable for a range of demanding systems in the medical, test and measurement, energy metering and power sectors.
Te IN 1500-S current sensor is specifically
designed for high performance and precision in 1500A nominal current applications, while the IN 1000-SHF current sensor is suitable for applications requiring very wide bandwidth. Te new products are the latest additions to the highly successful IN family of high-precision sensors, known for their high reliability in applications such as MRI, calibration units, power metres and energy measurement. “Our high-precision range of current
sensors is a flagship of unparalleled expertise in electrical measurement, no competitor has the same range, with the same performances,” said Marco Locatelli, Global Product manager for
smart grid and high precision at LEM. “Te IN 1500-S offers all the advantages
of the IN family for 1500A nominal current applications, such as high accuracy and low noise, while IN 1000-SHF is our champion for high bandwidth.” With IN 1500-S, the IN family for current
sensing now boasts eight devices, and it is LEM’s most advanced high-precision range of current sensors yet, underpinned by LEM’s closed-loop current transducers that use a highly-accurate zero-flux detectors based on LEM’s fluxgate technology. Te current sensors achieve ultra-
high precision current measurements for DC, AC and pulsed currents. LEM’s innovation takes fluxgate current
transducers to previously unachieved performance levels through digital technology, gaining not only a major reduction of the ripple from the fluxgate driving signal but significantly improving the device’s immunity to temperature effects, interference and supply voltage variation.
Siemens expands OSAT Alliance membership to build domestic semiconductor supply chains
Siemens Digital Industries Soſtware has announced the latest members to join its OSAT Alliance program which enables outsourced semiconductor assembly and test (OSAT) providers to develop, validate and support integrated circuit (IC) package assembly design kits (ADKs) that drive broader adoption of emerging technologies by fabless semiconductor and systems companies and help to build secure
domestic semiconductor supply chains. Te OSAT Alliance helps mutual customers
to fully leverage the integrated workflow across Siemens’ EDA portfolio (including Calibre soſtware, Innovator3D IC soſtware, HyperLynx soſtware and Xpedition Package Designer soſtware) and encourage selected supply-chain partners to develop design flows and assembly design kits (ADKs) so that their
customers can design, verify and validate efficiently and predictably for the partners’ advanced semiconductor integration platforms and technologies “Te OSAT Alliance has been designed
to help promote the adoption and growth of advanced semiconductor packaging throughout the industry’s ecosystem and enable system and fabless semiconductor companies to have a friction-free path to emerging packaging technologies,” said AJ Incorvaia, Senior Vice President and General Manager, Electronic Board Systems Division, Siemens Digital Industries Soſtware. Mosaic Microsystems, headquartered
in Rochester NY, will use Siemens’ EDA technologies to develop ADKs for its thin glass substrate technology for a range of microelectronics applications, photonics, RF/mmWave, MEMS and sensor technologies. “Joining the OSAT Alliance is a significant
step for Mosaic Microsystems as we continue to drive innovation in high-density advanced packaging,” said Chris Mann, Vice President of Business Development, Mosaic Microsystems.
08 June 2025
www.electronicsworld.co.uk
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