Contents Regulars


04 Technology 08 Focus: Private 5G 10 Column: Embedded design by Myk Dormer


12 Column: Silicon systems design by Alpinum


Features


16 AI – the engine behind the current data centre evolution By Aoife Foley, Professor and Chair in Net Zero, The University of Manchester


18 Introducing agentic AI in embedded systems


By Michaël Uyttersprot, Market Segment Manager for AI, ML and vision, Avnet Silica


20 Resilient AI-enabled infrastructure for modern defence operations By Anthony Soares, Defence Lead, Effi ciencyIT


22 Navigating the AI Act compliance By Iain Bowes, Head of Management System Assurance, TÜV SÜD Business


34 NFC-enabled security for consumer electronic systems By Marco A. Ramirez Castro, Embedded Systems Engineer, Analog Devices (ADI)


36 Solid-state batteries: Progress, pressure and the path to scale By Dr Dustin Bauer, Senior Associate, Reddie & Grose


24 Rethinking the power architectures for AI factories By Maurizio Di Paolo Emilio, Director of Global Marketing Communications, Effi cient Power Conversion (EPC)


28 Mitigating the internal failure mechanisms of DC power architectures By Giulio Bocciolini, Senior Product Marketing Manager EMEA, TDK-Lambda


38 Advanced data acquisition for better medical scanning systems By Teledyne SP engineers


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EDITOR: Stella Josifovska Tel: 01732 885810 Email: sjosifovska@datateam.co.uk


SALES: Richard Setters Tel: +44 (0)7794 805307 Email: rsetters@datateam.co.uk


PRODUCTION/DESIGN: Tania King Email: tking@datateam.co.uk


32 Avoiding the pitfalls of PCB design By Dunstan Power, Director, ByteSnap Design


42 Suppliers’ guide /Web locators


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www.electronicsworld.co.uk July/August 2026 03


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July/August 2026 Volume 131 Issue 2058 £5.90


IN THIS ISSUE: • AI • Power supplies • Consumer electronics • T&M


Regular columns: • Focus: Private 5G • Embedded design • Silicon systems design


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