Feature: Industry 4.0
Eff ective fume extraction in electronics manufacturing
By Arran Morgan, Product and Engineering Director, Donaldson BOFA M
anaging fume and gaseous organic compound emissions has long been important in electronics
manufacturing. Eff ective fume and particulate extraction helps electronics manufacturers protect their equipment, support product quality and maintain a clean workplace environment. However, in recent years the growing complexity of microelectronics, coupled with the miniaturisation of components, has intensifi ed the need for precision air quality control. Even microscopic contamination can result in solder joint failures, short circuits, or diminished performance. T e demand for speed places greater
emphasis on automation and the integration of all the constituent parts of the manufacturing process. For fume and dust extraction systems, this means investing in technical innovations that deliver an airfl ow management and fi ltration architecture that can capture
44 April 2026
www.electronicsworld.co.uk
emissions eff ectively, while stretching the periods between fi lter exchanges. T is will help electronics manufacturers to minimise downtime while increasing operations effi ciency and controlling costs. Electronics manufacturers must also
now take into account Industry 4.0 considerations as portable fume extraction solutions are helping to provide enhanced support and greater fl exibility against the demands of more agile manufacturing approaches. Portable systems are far more manoeuvrable than their fi xed counterparts, providing fl exibility that accommodates changes to the factory fl oor. T eir ability to be quickly repositioned to support evolving layouts, without the need for major infrastructure changes, is a signifi cant advantage in an Industry 4.0 environment.
Soldering fume extraction In wave soldering, PCB components areplaced on the board and passed over a continuous wave of molten solder. Areas not to be soldered are covered with a protective ‘mask’. While this process
doesn’t usually involve the potentially harmful resin/colophony present in hand soldering, it can require the use of an alcohol-based solvent such as isopropyl alcohol and a small amount of organic acid, fume from which needs to be fi ltered. Before soldering, the boards are ‘spray fl uxed’, using either a general spray process, which can generate airborne dispersions of fl ux particulates and vapours, or a targeted jet from a robotic nozzle. With refl ow soldering, solder paste is
applied to the PCB and components are then picked and placed. T e board moves through various heating, stabilising and cooling zones, during which the solder metal ‘refl ows’ or melts and solidifi es around the component connection. During this process, the solvent that makes the paste liquify will evaporate. All of these airborne emissions must be fi ltered through a fume extraction system. A temperature control unit can
help maintain optimal PCB print area temperatures in automated production lines. T is is crucial for solder reliability, component placement accuracy, defect
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48
