FUNDING RECEIVED FOR DEVELOPING 3D CERAMIC OBJECTS FOR SPACE APPLICATIONS N


ano Dimension has received funding from the Israel


Innovation Authority, which will go towards developing 3D ceramic materials, that can be used in inkjet technology, thus allowing the printing of low density and high thickness objects for space applications. This project is in collaboration


with Semplastics LLC and will focus on the utilisation of Semplastics’ novel ceramic material precursors using Nano Dimension’s 3D inkjet


printing technology, in order to build 3D high-thickness and low- density ceramic objects for aerospace applications. The mechanical strength and


thermal resistance properties of the ceramic materials make them a crucial element used for a variety of needs in the aerospace industry. The technologies available today, to create ceramic elements are expensive, time and energy consuming from the design stage until final assembly, and do not


support the creation of complex structures. 3D printing of high-resolution


ceramic materials has the potential to allow the creation of complex geometrical shapes, thus allowing rapid and cheaper production of small batches of designated ceramic objects, used in the aerospace industry. A novel ceramic material, developed by Semplastics and used in prototype space applications in cooperation with NASA, will be 3D printed for this project. A modified


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BUILDING A GRAPHENE-BASED NANOTUBE BIOSENSOR


Biosensors are devices that can detect biological molecules (“analytes”) in air, water, or blood. They are used widely in drug development, medical diagnostics, biological research, and even security. Despite ongoing advancements, there remains a need for improved portable biosensing devices that are easy to use for both doctors and patients. The development of such devices would offer methods for continuous, real-time monitoring


of biomarker levels, which is important for a number of diseases such as diabetes. Edward Honein an undergraduate student at the American University of Beirut is developing an optical, microfluidic biosensor that can detect single biomolecules in a scalable, high-throughput manner. The biosensor itself is made up


of carbon nanotubes, which are rolled-up sheets of graphene. Nanotubes have diameters as small as 1 nanometer and lengths up to


several centimeters, and their unique physical properties have opened up a whole new world of technologies. One of these properties is emitting light in the near-infrared spectrum (700 – 2500nm wavelength) when excited with a laser. Honein’s project draws from the research of Professor Ardemis Boghossian, who heads the lab at the Uni and combines nanotube optics and biological molecules. https://lnb.epfl.ch


Two new MEMS-based barometric pressure sensors from Omron Electronic Components Europe are specifically designed to support height and pressure measurement in drones, smartphones, pedometers and other battery powered mobile systems. The new Omron 2SMPB- 02B and 2SMPB-02E sensors provide height and pressure measurements, allowing changes in elevation of as little as 2m to be recorded. The new sensors have been remodelled for mobile applications and are smaller at just 2.0 x 2.5 x 0.85mm in size. The new barometric sensors measure pressure with high accuracy based on the built-in low noise 24bit ADC and feature digital control and output via I2


C SPI interfaces. www.components.omron.eu IMPROVE HEAT DISSIPATION W


elcome to the Autumn issue, where we kick off with a focus on how CMOS nano- sensor technology is addressing the challenge of stiction in MEMS inertial sensors on p8. September marks the ninth year for Micro Nano MEMS, the industry-leading event for ultra precision technologies for MEMS and nanotechnology fabrication. Turn to p10 to find out the latest show highlights. Our cover story


special looks at how ultralow IQ ICs are effectively powering smart wearable devices. Also don’t miss our spotlight on Micro-isotropic etching for MEMS and optical MEMS devices on p10, along with the latest news. Michelle Winny - Editor


The lifetime of electronic applications can be dramatically reduced by the increase of the working temperatures by just a few degrees. Further, the insulation of the whole printed circuit board (PCB) from the environment, in order to provide efficient protection against humidity and dust for certain applications, turns heat dissipation into an even more challenging task. State-of-the-art thermal


management in the PCB is done by basically adding more copper to the PCB structure with constructions such as thick copper layers, Plated Through Holes (PTHs), copper filled laser vias or even copper inlays. Thermal solutions such as modern


miniaturised heat pipes, which are light, have superior thermal conductive properties than copper and have sizes that are compatible with PCB dimensions can address thermal management challenges in modern high-end applications. Modern heat pipes are small enough to be incorporated into PCB


4 AUTUMN 2017 | MICROMATTERS


constructions. Their thickness can range from about 400µm up to 2mm. The application of heat pipes directly in the PCB body allows new design freedom such as remote cooling, heat guiding and heat spreading. For example, heat guiding may open room for the implementation of temperature sensitive components such as sensors and MEMS close to heat generating devices such as transistors. Further, the enhanced cooling capabilities of embedded heat pipes PCBs (HP-PCBs) may allow devices to run at lower temperatures which will in turn increase efficiency, lifetime and energy savings to most electronic applications. AT&S demonstrated an innovative approach of associating “ready-to- use” mini heat pipes to the PCB body turning it into a complete heat management module. Different strategies were used to associate miniature heat pipes with the PCB. In all experiments, the HP-PCB concept helped increase the system’s overall thermal performance in comparison with current technologies. www.ats.net


A Bi-Directional Differential Pressure Sensor has been launched by MEMSIC for CPAP, breath detection, room pressure, damper control, flow hood, fume hood, filter monitoring and other applications where ultra-low differential pressure performance is required. The new MDP200 pressure sensor is based on the company’s MEMS thermal accelerometer platform. This ultra-sensitive MEMs thermal technology enables the new device to detect minute changes in flow induced by differential pressure. The suspended bridge microstructure inside the MDP200 allows it to reliably detect pressure changes from a range of 0.016 Pascal to 500Pascal.


www.memsic.com


resin will be developed for the Nano-Dimension 3D printer during this project, resulting in a light- weight yet highly mechanically stable object. "We are very excited to


collaborate with Nano Dimension on this innovative project", said Bill Easter, CEO of Semplastics. "Building on our successful work with NASA, we see this work opening up even more applications for our unique ceramic materials." www.nano-di.com


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