Adhesive Applications
New electrical-insulating adhesive turns heat off I
nseto, a technical distributor of equipment and materials, is now supplying DELO’s new MONOPOX TC2270,
a thermally conductive, electrically insulating adhesive, which is ideal for bonding silicon die and other applications where rapid heat transfer is essential. For example, heat build-up is a common
reason for integrated circuit failure and the efficient dissipation of heat in power semiconductors, as used increasingly in automotive applications, is a considerable challenge. With a specific thermal conductivity of 1.7 W/mK, DELO MONOPOX TC2270 ensures efficient heat transfer between die and packaging. It is also cheaper than silver epoxy, which has the often-unwanted property of being electrically as well as thermally conductive. Supplied in 10ml syringes, DELO
MONOPOX TC2270 boasts many other
benefits too. For instance, the minimum curing temperature is 60oC in about 90 minutes, which means it can be used with temperature sensitive materials with little risk of introducing stress or causing warpage. In addition, it is a one-part adhesive, so no mixing is required and storage is at -18oC, a temperature
MONOPOX TC2270 is a specialist adhesive ideal for chip bonding, and other applications where electrically insulated heat transfer is required
accommodated by standard commercially available freezers; whereas most die-attach adhesives need to be stored in industrial freezers at much lower temperatures, such as -40oC. Once cured, DELO MONOPOX TC2270
delivers a die shear strength of 60N/mm2 and has an end-application use range of -40 to +150oC, which is more than adequate for most silicon-based semiconductors. Eamonn Redmond, sales manager of
Inseto, comments: “The adhesive’s chemistry includes aluminium nitride, which ensures heat is quickly transferred away from the die, thus increasing the potential lifetime of the chip. Also, the fact that it is readily available in 10ml syringes means that users reduce the risk of having to dispose of out-of-date adhesive.”
inseto.co.uk
Optimising adhesive consumption without compromising durability or quality
B
aumer hhs is an advanced partner of the touchpoint packaging special show at drupa 2020 in Germany. As a
supplier of adhesive application systems to the folding carton, print finishing and other converting industries, the company, based in Krefeld/Germany, has years of know-how with which it is shaping the future of packaging production – and which it will be contributing to this Messe Düsseldorf project. At the touchpoint packaging special show, Baumer hhs will be focusing on sustainable resource management for tomorrow’s packaging production process. “We’re very pleased that as a touchpoint
packaging partner, we’ll have a special forum at drupa 2020 where we can join with others in the industry and showcase our ideas for enhancing sustainability and achieving an eco-friendly, future-oriented packaging production process”, says Andreas Brandt, marketing manager at Baumer hhs. The company, he adds, is presenting two projects at the special show that will meet the high expectations of organisers and visitors alike. “The less glue you use in packaging
production, the better the environmental footprint of an individual product and the overall process. Optimising adhesive consumption in industrial applications has long been one of our core competencies,
convertermag.com
and over the years we’ve launched a series of pioneering solutions on the market. At the touchpoint packaging show, we’ll be demonstrating how packaging manufacturers can reduce their adhesive consumption without compromising on the quality or durability of glued joints. We’ll also be presenting our GlueCalc smartphone
app, which helps manufacturers to quickly and easily calculate how much they can reduce costs and CO2 emissions by gluing packaging with dots instead of beads of glue,” Brandt continues. In a second project, Baumer hhs is demonstrating ways to eliminate UV tracers and colourants from packaging production in future. “Using UV tracers and colourants in the production of packaging materials can disrupt the fibre cycle and cause unwanted contamination of food packaging. If these substances can be eliminated, food-grade packaging manufacturers can significantly increase process safety, with the benefits extending to brand owners and consumers as well”, Brandt explains. “Baumer hhs will likewise be exhibiting innovative solutions for mastering this challenge at the touchpoint packaging show.” The touchpoint packaging hotspot at drupa 2020 is located in a dedicated area of Hall 3. In addition to participating in touchpoint packaging 2020 in Hall 3, Baumer hhs will also have its own stand at drupa 2020 in Hall 6 (Stand A40), where it will be exhibiting innovative adhesive application and quality assurance solutions for various industries, including folding carton and print finishing.
baumerhhs.com March 2020 37
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