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follows additional investments from suppliers across the sector, including ASH Inspex HD digital microscopes for high- quality PCB inspection and Antistat’s ESD protection equipment to strengthen training around electrostatic discharge control.
Together, these upgrades ensure that every course at A.R.T. is underpinned by the latest technology, aligning training delivery with current industry standards.
Debbie McDade, managing director of A.R.T., said: “For more than 35 years, our
focus has been on delivering training that reflects the real-world environments our delegates will return to. By continually investing in new technologies, we ensure our courses provide practical, relevant skills that transfer directly into the workplace.
This means our customers can be confident their teams are trained on the same equipment and processes they’ll use every day in production.”
www.rework.co.uk
New DualPack 3 IGBT7 modules deliver high power density and simplify system integration
M I
icrochip Technology’s new family of DualPack 3 (DP3) power modules features advanced IGBT7 technology
available in six variants at 1200V and 1700V with high-current ranging from 300–900A. The new DP3 power modules are designed to address the growing demand for compact, cost-effective and simplified power converter solutions. These modules use the latest IGBT7 technology, engineered to reduce power losses by up to 15-20 per cent compared to IGBT4 devices and operate reliably at higher temperatures up to 175°C during overload. DP3 modules enhance protection and control during high-voltage switching, making them suitable for maximizing power density, reliability and ease of use in industrial drives,
renewables, traction, energy storage and agricultural vehicles.
Available in a phase-leg configuration, the DP3 power modules in a compact footprint of approximately 152 mm × 62 mm × 20 mm, enable a frame size jump for increased power output. This type of advanced power packaging eliminates the need for paralleling multiple modules and helps reduce system complexity and Bill of Materials (BOM) costs. Additionally, DP3 modules provide a second-source option to industry-standard EconoDUAL packages for greater flexibility and supply chain security for customers. “Our new DualPack 3 modules with IGBT7 technology can reduce design complexity and lower system costs while maintaining high performance,” said Leon Gross, corporate vice president of Microchip’s high-reliability
and RF business unit. “To further streamline the design process, our power modules can be integrated as part of a comprehensive system solution alongside Microchip’s microcontrollers, microprocessors, security, connectivity and other components to accelerate development and time to market.” The DualPack 3 power modules are
well-suited for general-purpose motor drive applications and address common challenges such as dv/dt, complexity in driving, higher conduction losses and no overload capability. They are now available in production quantities.
www.microchip.com Intelliconnect strengthens senior management team
ntelliconnect (Europe), the RF and cryogenic interconnect solutions specialist, has strengthened its senior leadership team with the appointment of Yiannis Metallinos as managing director and Gary Langridge as engineering manager.
Intelliconnect is a provider of interconnects, cable assemblies and subsystems for applications in RF, microwave, defence, space, medical, test and measurement, education, research, quantum computing and other emerging low-temperature computing markets.
Yiannis Metallinos brings extensive leadership and operational experience gained across PE, private and PLC environments, spanning industries including electronics, precision engineering, FMCG, EV, automotive and marine. With expertise across manufacturing, engineering, and quality, he has a proven track record in driving organisational development, operational excellence, and talent management.
www.cieonline.co.uk
Gary Langridge offers more than 30 years of engineering and product development experience. His career spans industries where technical innovation must balance with cost, quality, and time-to-market. Gary’s background in product manufacturing organisations will support Intelliconnect in reducing the cost of solution development and lifecycle management while enhancing engineering capabilities.
Steve Groves, sales & marketing director at Intelliconnect (Europe), said: “We are the supplier of choice for many of the leading American and European Defence, Medical and Marine OEMs and our product development and sales of RF and cryogenic interconnect solutions continue to grow as the market for these technologies expands. We are very pleased to welcome Yiannis and Gary to our management team to ensure that Intelliconnect continues to innovate and meet the future needs of our customers.”
www.intelliconnectgroup.com Components in Electronics September 2025 9
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