Supplement: Semiconductors


Make the switch from mechanical to photorelays in automated testing equipment applications


By Kazuhiro Natori, product application engineer, product marketing, Toshiba Electronics Europe GmbH


Figure 1 – Block diagram showing the internals of a photorelay


W 46 May 2024


ith the rapid advancement of digitalization and electrification, the pressure to


accelerate the manufacturing and testing of semiconductors to meet growing demand is more critical than ever. The surge underscores the essential role of semiconductor Automated Test Equipment (ATE).


Mechanical relays, long valued for their ability to switch high voltage and current signals with low voltage inputs, are now being challenged by the emergence of photorelays. These solid-state devices offer a range of benefits, including greater reliability as they don’t have moving parts, which are prone to wear and failure over time. Applications like automated test equipment (ATE) require photorelays with specific features to be used. This article compares and contrasts


Figure 2 – Simplified model of photorelay operation


Figure 3 – High frequency model of photorelay


mechanical and photorelays, aiming to provide a comprehensive understanding of the features to look for when selecting


Components in Electronics


a photorelay for use in ATE applications. It explores the capabilities of Toshiba’s TLP3412SRLA based on performance,


reliability, and its ability to meet the demanding specifications of contemporary semiconductor testing environments.


www.cieonline.co.uk


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