Meet the 2024 EIA nominees… Product Awards
Aerospace/Military/Defence Product of the Year
● 0.5m VHDCI cable, Cliff Electronics
● 12 multimode fiber Q-ODC extension connector 7.0mm, Huber + Suhner
● EPC 7018, Efficient Power Conversion ● Integrated Actuation Power Solution, Microchip
● NXS Series with EMI Flange, Smiths Interconnect ● Resistive Power Dividers, Smiths Interconnect ● SAMD21RT 32-bit MCU, Microchip
Automotive Product of the Year ● OX08D10, OMNIVISION
● GRF5507W, GRF5517W, GRF2106W and GRF2133 W Linear Power Amplifiers and Low Noise Amplifers, Guerrilla RF
● TA101, Microchip
● NOVELDA X7 Ultra-Low Power Presence Sensor, Novelda AS ● Cavli AQ20 Automotive Grade Cat 4 module, Cavli Wireless
● Molex MX-DaSH Data-Signal Hybrid Connector Portfolio, Molex
● RAA279974 Four-Channel AHL Video Decoder for Automotive Cameras Enables Economical Surround View Applications, Renesas Electronics
● SuperGuard: The C Library Safety Qualification Suite from Solid Sands, Solid Sands
Display Product of the Year ● MXT2952TD 2.0 family, Microchip
● P624-C 23.8”” FHD TFT Widescreen Industrial LCD Monitor, Axiomtek
● G185HAN01.4 18.5"" high-brightness AUO display, Data Modul
● microLED display, Smartkem ● ClearVue, Crystal Display Systems
● e-Paper displays, Review Display Systems
Enclosure Product of the Year ● Pi Cube, CamdenBoss Ltd
● Monitoring Case System, Phoenix Contact
● HANDHELD CASE with SHOCKPROOF COVER, Takachi - LCT series
● CAB P 504023 S 8104325, Fibox
● Agent E swinghandle, EMKA (UK) Ltd ● MXT2952TD 2.0 family, BOPLA
Internet of Things Product of the Year ● Blecon, Blecon
● ECC608 TrustMANAGER, Microchip
● Cavli CQS290 Smart Cellular IoT Android Module, Cavli Wireless
Engineering Development/ Design Tool of the Year
● AI Workbench – Cloud-Based Environment to Accelerate Automotive AI Software Development and Evaluation, Renesas Electronics
● CHERI, Codasip
● Lattice Radiant™ design software, Lattice Semiconductor ● Palladium Z3 and Protium X3 Systems, Cadence ● PolarFire® SoC Discovery Kit, Microchip ● Tracealyzer SDK, Percepio AB
Interconnection Product of the Year ● Push-X, XPC 1.5 Series., Phoenix Contact Ltd
● Molex MX-DaSH Data-Signal Hybrid Connector Portfolio, Molex
● Mezza-pede® SMT Connectors, Advanced Interconnections
● Microflex Hi-Rel Flexible Harness - 2mm pitch - MIL-DTL-55302F, Nicomatic
● YFLEX High Temperature Resistant, Yamaichi Electronics ● D04 Connectors, Smiths Interconnect
● HR34P Series panel mount connector, Hirose
● ENNOVI-MB2B multi-row board-to-board (BTB) connector platform, ENNOVI
Power Product of the Year ● 3.3 kV XIFM Plug-and-Play mSiC Gate Driver, Microchip
● 60V-Rated Synchronous Buck Converters AP66200Q / AP66300Q, Diodes Incorporated ● ArcZero, Phoenix Contact ● ClassEgg, Eggtronic
● EP71xx Family, Empower Semiconductor ● GaNSafe™ Power IC, Navitas Semiconductor
● InnoMux-2, switcher IC family with multiple, independently regulated outputs, Power Integrations
● InnoSwitch3-EP 1250 V GaN IC, Power Integrations
● IT6600C Bidirectional Programmable DC Power Supply, ITECH Electronics
● L91 Lithium Energizer AA Battery, Energizer
● NeoPower™ NP08 AC-DC Configurable Power Supplies, Advanced Energy
● nPM1300 Power Management IC (PMIC), Nordic Semiconductor
● QuarEgg 70W Power Delivery, Eggtronic ● TECS/TEPS, COSEL
● VGaN: bi-directional functionality in BMS systems, Innoscience
Embedded Solution Product of the Year ● AIE-PN33/43, Aetina Corporation
● IA380-QUFL (A380E Intel PCIe), Aetina Corporation ● AIP-FR68, Aetina Corporation ● PIC32CK 32, Microchip ● xcore®.ai, XMOS
● RA8 Series – Ultra-High Performance MCUs are Industry’s First Based on Arm Cortex-M85 Processor; Provide 4X Performance Boost for DSP and ML Implementations, Renesas Electronics
● FSM:GO, FRAMOS
● NECTO Studio 6.1, MIKROE ● Apollo510 MCU, Ambiq
● The ROM-2860 size-L OSM miniature solder-on module from Advantech, Advantech
● DA14592 – Renesas’ Lowest Power Consumption, Dual-core Bluetooth Low Energy SoC with Integrated Flash Enables “Crowd-Sourced Locationing”, Renesas Electronics
● The AIR-150 Edge AI Inference System from Advantech, Advantech
● COM EXPRESS® TYPE 6 MODULE, SECO ● TCR3LM series, Toshiba Electronics Europe
Medical Product of the Year ● CUS250M, TDK Corporation
● D04 Connectors, Smiths Interconnect
● EP71xx Family, Empower Semiconductor ● MAD50 series, P-DUKE
● MDP520 and DDP520, Enedo Power
● MINIMET aluminium enclosures, METCASE ● Planatome Surgical Blades, Planatome
● RA2A2 microcontroller (MCU) Group, Renesas Electronics
● Snap-In Male cable connector, Contacts: 3, 3.5-5.0 mm, unshielded, solder, IP67, Binder
34 June 2024
Components in Electronics
www.cieonline.co.uk
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