MPUs & MCUs Figure 2 – Key components in a heat pump design


estimates the rotor angle using current feedback provided by a simple shunt resistor, meaning additional sensors are not required. The FOC mathematical model demands complex processing that is beyond the resources of traditional MCUs due to their limited instruction sets. Instead of direct computation, these MCUs rely on lookup tables to perform trigonometric functions


and complex multiplications. An alternative approach is to use multiple MCUs, sometimes in combination with a digital signal processor (DSP), to implement the FOC calculations. A more integrated approach is to use a single system-on-chip (SoC) device that can also manage all the major functions of a heat pump. Toshiba’s TMPM4KL MCU, which is based on an Arm Cortex-M4 RISC-based


processor core running at speeds of up to 160MHz, offers such a solution. It also features an Advanced Vector Engine (A-VE), which provides the additional instructions and hardware support for the advanced DSP required for performing FOC calculations. A-PMD on-chip hardware enhances PWM performance with an integrated wave generator and synchronous trigger circuit. It


generates precise PWM signals and inserts critical dead-time intervals to prevent shoot-through in power stages. Additionally, automatic scheduling of these functions is enabled by monitoring a single shunt current. The RD219 reference design features the TMPM4KL MCU and several other carefully curated components. For example, in the compressor unit, the TK20A60W5 600V DT-MOS MOSFET offers low conduction losses and low parasitic capacitances for fast and effi cient switching. In addition, the TPD4204F, which integrates a level-shifting gate driver IC and superjunction MOSFETs, simplifi es motor-phase switching control. The TC78B011FTG sensorless motor control driver can be used to control additional motors. All of these components can be managed by the TMPM4KL, which, thanks to its accelerators, can control two motors using FOC, handle PFC and manage pump-motor controllers’ solenoid-operated valves.


Toshiba’s RD219 reference design presents a blueprint for constructing effi cient heat pumps. It uses a combination of advanced silicon-based digital control as well as high-performance power devices based on wide-bandgap and silicon semiconductor technologies. https://toshiba.semicon-storage.com/eu


    


     


   when a new issue 


    


    


    


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