NEWS KTE V7.1 release Comment A
S530 Series Parametric Test System. New options include a new parallel test capability and a high-voltage capacitance test. The new testhead design
T
allows flexibility in use of varying probe cards. The upgraded software and hardware enables single- pass testing and high throughput. The recently released System Reference Unit (SRU) shortens the calibration time to less than eight hours, meaning they can be completed quickly. The SRUs can be purchased directly or with an annual SSO service plan. The S530 now features a powerful parallel test option that further improves productivity and lowers testing costs with an anticipated 30 percent improvement range (depending on tests and structures). Built on the S530’s hardware architecture that enables up to eight high- resolution SMUs to connect to any test pin through any fully Kelvin port/row in the system, Keithley’s parallel test software optimises the efficiency of all system resources to maximise test throughput.
www.Tek.com
ektronix, Inc. has released KTE V7.1 software for the Keithley
s seasonal change sweeps in on the autumn breeze it brings with it much activity within the component sector and
this issue reflects that with much news and activity across many industrial sectors. Most notably, activity in the automotive sector has increased and in this issue on p8 Perforce focuses on the state of automotive software development. Micrometal discusses the role of photo chemical etching in the manufacture of precision metal parts and components in the automotive industry on p10. In our cover story this month Powell Electronics explores the latest Innovative connector solutions for modern agricultural machinery
Galileo Test Socket
needs on p12. TÜV SÜD discuses
coping with the rise in counterfeit components and products on p14. Gurtam
investigates the role smart technology has to play in the transportation industry on p18, plus much more. Michelle Winny, Editor
1.6T EthernetPHYwithupto 800 GbE connectivity for5GandAI
and up to 800 Gigabit Ethernet (GbE) connectivity to handle escalating data center traffic driven by 5G, cloud services and Artificial
R A
Smiths Interconnect’s new Galileo test socket for Area Array and
Peripheral Package Test is a low-profile test socket engineered to support today’s high performance Digital and RF applications. It uses interposer elastomer technology and advanced 3D printing manufacturing to provide a high-performance solution for BGA, LGA, QFP, SOIC, or QFN packaged devices with extremely short lead times. Using “universal” elastomer contact assembly, Galileo supports almost any standard package pinout, on any pitch (or multiple pitches) at >0.35mm, in any configuration,
with no extra tooling charges.
www.smithsinterconnect.com
Intelligence (AI) and Machine Learning (ML) applications. To deliver the higher bandwidth, these designs need to overcome the signal integrity challenges associated with the industry’s transition to the 112G (gigabits per second) PAM4 Serializer/ Deserializer (SerDes) connectivity that is needed to support the latest pluggable optics, system backplanes and packet processors. These challenges can now be overcome with the 1.6T (terabits per second), low-power PHY (physical layer) solution from Microchip Technology Inc. With its PM6200 META-DX2L that reduces power per port by 35 percent compared to its 56G PAM4 predecessor,META-DX1, the industry’s first terabit-scale PHY solution. With its high-density 1.6T bandwidth, space-saving footprint,
112G PAM4 SerDes technology, and support for Ethernet rates from 1 to 800 GbE, Microchip’s META-DX2L Ethernet PHY is an industrial-temperature-grade device that offers the connectivity versatility to maximise design reuse across applications ranging from a retimer, gearbox or reverse gearbox to a hitless 2:1 multiplexor (mux). Highly configurable crosspoint and gearbox features make full use of a switch device’s I/O bandwidth to enable the flexible connections necessary for multi-rate cards that support a wide range of pluggable optics. The PHY’s low-power PAM4 SerDes enables it to support the next-generation infrastructure interface rate for cloud data centers, AI/ML compute clusters, 5G, and telecom service provider infrastructure.
www.microchip.com
outers, switches and line cards need higher bandwidth, port density
Newnon-magnetic RF inductor series –28MG
Gowanda Electronics has introduced its new non-magnetic RF thru-hole (leaded) inductor series – 28MG. This series is ideal for use in medical imaging equipment and other applications where magnetic materials must be avoided. Design specifications include meeting the needs for non-magnetic inductors that
4 SEPTEMBER 2021 | ELECTRONICS TODAY
could achieve inductance values of up to 18µH for use in Magnetic Resonance Imag- ing (MRI) equipment, specific types of X-ray equipment and other applications where the presence of magnetic materials could compromise system performance. This in- cludes applications in telecommunications, security systems, instrumentation, labora-
tory analysis equipment, aviation equip- ment, navigation equipment and electronic test equipment. The performance range provided by the
60 discrete parts includes Inductance from 1.2µH to 18µH, DCR Ohms from 0.079 to 4.15
and Current Rating mA DC from 315 to 2400.
www.Gowanda.com
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58
