SENSORS
Novotechnik RFE-3200 angle sensor
Newtelecentricmeasurementsystem
boasts an exposure time of just 25µs – 40 times faster than conventional models, allowing accurate measurement of high-speed targets by eliminating blur from the image. It provides a versatile solution for a broad spectrum of industrial measurement applications, offering geometric dimensioning and tolerancing (GD&T); outer diameter and profile measurement; abnormality detection; and runout and positioning. The specially designed telecentric optics greatly improve measurement repeatability by increasing uniformity throughout the field of view.
www.keyence.co.uk/tmxrelease
K N
elecs and S-Pedelecs. Based on Hall technology, the sensor in combination with an external, ferromagnetic speed disk achieves a high-resolution speed measurement. The sensor targets the slot structure of the speed disc and, depending on the number of slots, it transmits up to 50 or more speed signals per wheel revolution. In practice, this leads to a finer and quicker response from the e-bike drive. With the precise speed values of both wheels, the ABS control unit can adjust the wheels to each other and brake them in a con-
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trolled manner. https://switches-
sensors.zf.com/sensors/
ew from Variohm Eu- roSensor, RFE-3200 se- ries angle sensors are
built for precision rotary posi- tion sensing tasks in harsh environments. The two-part ‘Touchless technology’design comprises a fully encapsu- lated Hall sensor element in an IP69K sealed housing and a separate magnetic posi- tion marker.
www.variohm.com
Laser depaneling
he ZF e-bike speed sensor GS82-AA02 was specially developed for use in Ped-
UTACQualifiesa Automotive Grade iBGA Package
U
TAC Holdings Ltd. has successfully qualified a CMOS image sensor
using a 9.0mm x 8.0mm iBGA package to the demanding AEC-Q100 Grade 2 standard for one of its key customers. Meeting the AEC-Q100 standard is very challenging as the package needs to meet stringent requirements on reliability, safety and quality. During the qualification, devices are subjected to elevated temperature and humidity, temperature cycling and high-temperature operation. Internal wire bonds in the devices are required to endure pull testing to confirm their integrity. “Our engineers work closely
with customers worldwide to ensure our packaging and test programs are optimised, enabling qualification in a stringent and demanding environment,” said Dr John Nelson, President & CEO of
UTAC.
www.utacgroup.com
In stock: Single AxisMEMS Capacitive Accelerometers
single axis Model 2210 series. These MEMS capacitive ac- celerometer modules offer accurate and repeatable measurements across a va-
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riety of lower-frequency vibration testing applications, including those common to vibration analysis, machinery control, modal analysis, robotics, and crash event detection. Offered in standard ranges from ±2g to ±400g, the rugged design of the Model 2210 series incorporates a MEMS capacitive accelerometer chip to- gether with high-drive, low-impedance buffering. When used along with a mounting block accessory, such as the company's own Model 2330-BLK, the series can measure vibration and ac- celeration on either one, two, or three orthogonal axes with equal accuracy and repeatability. The measurement versatility allows customers to specify just one part number for multiple, unique measurement requirements, thereby reducing in-house costs and inventory counts. All Silicon Design’s Model 2210 series MEMS capacitive ac- celerometer modules generate two analogue voltage outputs, which vary in response to applied acceleration. Customers can utilise either a single-ended or differential output, the latter of which doubles accelerometer sensitivity. The sensitive axis of the Model 2210 series is perpendicular to the package bottom, with positive acceleration defined as a force pushing on the bottom of that package. Output scale factor is independent from the
supply voltage of +8 to +32V.
www.SiliconDesigns.com
ilicon Designs, Inc. has immediately available stock quantities of its
eyence has introduced a new inline telecentric measurement system which employs highly advanced silhouette-based analysis for guaranteed accuracy. Designed specifically to measure parts rapidly and consistently as they pass through the system, the TMX5000 line-up
Bosch sensor evaluation board for rapid prototyping
The newly launched Application Board 3.0 from Bosch Sensortec simplifies the evaluation and prototyping of sensors for a wide range of applications. To maximise scalability, any sensor – mounted on a ‘shuttle board’ – from Bosch Sensortec is simply plugged into the socket on the Application board. All shuttle boards
42 SEPTEMBER 2021 | ELECTRONICS TODAY
have an identical footprint, and Bosch Sensortec’s software automatically detects which sensor is plugged in at any given moment and launches the appropriate software. This enables the straightforward evaluation of a wide range of sensors and solutions. Prototypes can be easily built to quickly test different use case
configurations. The new board offers a small form factor, measuring just 47.0 x 37.0 x 7.0mm3, which is ideal for evaluating sensors in portable applications. It can be powered using a 3.7V Li-ion battery or a standard 5V USB power
supply.
www.bosch-sensortec.com
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