FEATURE THERMAL MANAGEMENT & EMC
UNDER THE WEATHER Industrial thermal camera improves on IR thermometers
F
lir Systems’ TG297 industrial thermal camera looks to solve thermal management concerns through its non-contact
measurement and imaging capabilities, embedded within one tool. The benefits of this comes in the application: troubleshooting is facilitated by the thermal filter, allowing inspectors to visually identify error in high-temperature environments and sectors such as manufacturing and furnaces. Built around a 160 x 120 Flir Lepton thermal sensor and Flir’s
image processing algorithms, the TG297 can examine potentially dangerous areas such as electrical connections, for spikes in temperature or mechanical damage. The high-temperature filter and multi-spectral dynamic imaging (MSX) dual-camera technology adds clarity to the thermal dynamic range that defines the cause for concern. And concerns over its functionality within these extreme environments can be put to rest, thanks to a rugged IP54 enclosure and a long-lasting, rechargeable Lithium-ion battery. Flir Systems
www.flir.co.uk
Ready, Steady, Protect
T
urning away from corporate applications, Hylec looks to the consumer/commercial market, designing terminal blocks that
can withstand the harsh environments one creates with an oven or large range cooker. Screw to tab terminal block models, with between two and seven poles, are available in the FV Series, which operates at temperatures from – 5 to + 150 degrees Celsius. The PA family of terminal blocks includes Series PA84, which offers an earth bracket version and a fuse holder version, both available with or without screws. There are devices in the FV Series designed to suit gas, electric and ceramic hobs, motors and pumps, etc. For gas hobs, PA299 and PA299C are snap-in fixing on chassis terminal blocks with integrated cable clamps, earth brackets and an RF filter; PA233SN is suited for electric hobs and ovens, with an integrated cable clamp and grounding plate. The devices are IP30 rated and VDE approved. Hylec-APL
www.hylec-apl.com
SYSTEM CELSIUS CHECKS - SIMULATING FOR SUCCESS
A
s temperature threatens to derail circuitry, causing late-stage design
modifi cations, the electronics industry demands time-consuming thermal transient analysis techniques, deployed with traditional steady-state analysis, to address multiple power profi les and increased heat dissipation, guaranteeing a project reaches its pre- determined destination. However, traditional simulators, designed to solve these kinds of concerns, require simplistic electronics/ enclosures models to operate eff ectively, reducing accuracy. Cadence Design Systems’ Celsius Thermal Solver is an electrical-thermal co-simulation solution that hopes to answer the industry’s interrogation of this area, for application within various areas of the electronic hierarchy, from ICs to enclosures. Following the successful launch of the
Clarity 3D Solver earlier this year, the Celsius Thermal Solver is the second product in Cadence’s new system analysis initiative. Based on a production-proven, parallel architecture that delivers up to ten times faster performance than legacy solutions
without sacrifi cing accuracy, the Celsius Thermal Solver integrates with Cadence IC, package and PCB implementation platforms. This enables new system analysis and design insights, and empowers electrical design teams to detect and mitigate thermal issues early in the design process, reducing electronic system development iterations. Cadence’s solution utilises multi-physics technology to address these challenges. By combining fi nite element analysis (FEA) for solid structures with computational fl uid dynamics (CFD) for liquids, the Celsius Thermal Solver enables complete system analysis. In addition, the Celsius Thermal Solver performs both static (steady-state) and dynamic (transient) electrical-thermal co-simulations, based on the actual fl ow of electrical power in advanced 3D structures, providing visibility into real-world system behaviour. By empowering electronics design teams to analyse thermal issues early and share ownership of thermal analysis, the Celsius Thermal Solver reduces design re-spins, enabling new analysis and design insights.
In addition, the Celsius Thermal Solver accurately simulates large systems with detailed granularity: structures as small as the IC and its power distribution, together with structures as large as the chassis. “As part of our Intelligent System Design
strategy, Cadence is applying our extensive computational software expertise to new system innovations that address critical customer pain points,” said Tom Beckley, senior vice president and general manager, Custom IC & PCB Group at Cadence: “Following the highly successful launch of our Clarity 3D Solver earlier this year, the Celsius Thermal Solver helps our customers overcome the crucial challenge of system design and analysis of thermal eff ects, and furthers Cadence’s expansion into new system domains.” Cadence
www.cadence.com
32 OCTOBER 2019 | ELECTRONICS
/ ELECTRONICS
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