EDITOR’S CHOICE NEWS


AERCO OFFERS GLENAIR RUGGEDISED PCB MOUNT OPTO-ELECTRONIC TRANSCEIVER MODULES


G


lenair’s innovative small form factor PCB mount opto-


electronic transceiver modules are ruggedised harsh environment equivalents to SFP transceivers, but with a mechanical design suited to harsh temperature, vibration and shock environments, such as those found in Military, Aerospace, Oil and Gas, Railway, and Industrial applications. Targeted for ‘inside the box’,


these connectorised optical modules offer one of the smallest footprints available, saving over 60% space over SFP solutions, with no soldering required and support for up to 10Gbps rates.


The range includes parallel optical transceivers with MT ribbon fibre interfaces and shielded radiation-tolerant transceivers, hardened for mission critical applications. There is optional support for a Digital Monitoring Interface (DMI) in accordance with SFF 8472.


The transceiver module is


comprised of a transmitter section and a receiver section that reside on a common package and employ Glenair’s highly tolerant GC fibre optic connectors. Interfacing with the host board is through a 30Gbps Samtec high-speed surface mount electrical connector, employing


CML signalling with 100ohm differential inputs and outputs. Multi-mode and single-mode fibre versions support solutions up to 10Gbps with 10Km reach or 2.5Gbps with 40Km reach are available. Glenair fibre optic jumpers


connect from the transceiver to any Glenair Mil/Aero fibre optic connector style and a full range of evaluation boards are available, including an FPGA Mezzanine Card (FMC) version. Standard rating is for -40°C to 85°C operating temperature range, with extended temperature ranges available on request. www.aerco.co.uk


Amphenol ICC’s Minitek Pwr 5.7mm Connector System for power applications requiring a high current solution is now available from TTI, Inc.. Featuring polarised mating geometry to prevent mismating and scoop-proof housings to prevent terminals from damage, this connector system provides a vertical through- hole and wire-to-board solution targeted at industrial & instrumentation, data, communications, consumer and military applications. This range has contacts rated up to 23A


ADDITIONAL RF COAXIAL SPRING PROBES FOR HIGH FREQUENCY TEST


Charles Technologies (ECT) recently launched two new high frequency test probes for the PCBA test market. The CSP-40A-024 and CSP-40G-021 radio frequency probes are designed to mate to a variety of industry standard connectors such as MMCX, Fakra, SMB and U.FL. The CSP-40 coaxial probes provide an instrumentation quality interface for broadband RF measurements in excess of 6GHz, and provide a cost-effective solution for high volume board testing. The CSP-40 series is capable of bandwidth measurements in excess of 6GHz @ -1dB. These probes allow


for high frequency functional tests in both high volume testing and engineering lab environments. The probes provide consistent 50Ohm impedance for repeatable measurements. The CSP-40A-024 and CSP-40G-021 provide spring-loaded compliance for both the centre signal probe and outer housing that provides ground contact. The articulated contact allows for correction of targeting errors. The CSP-40 series features a rugged design for inline applications and an easy to replace center conductor probe. The adjustable snap ring feature ensures easy and reliable mounting. Tony DeRosa, senior product manager, explains: "The CSP-40 series meets the need for cost effective, high


performance functional testing at high speed. Our engineers designed these probes to mate with several industry standard connectors. They provide excellent performance for our board test customers in both engineering lab and high volume applications. It utilises Xcerra's knowledge in providing solutions for signal integrity sensitive applications, and we have over 15 years experience simulating complex test structures including probes, PCBA's and launches. We build and test many structures to validate our products and corresponding models."


https://shop.ect-cpg.com/product/csp-40a-024


each, made from high-conductivity copper with either tin or gold plating. As terminals are post-plated, they prevent corrosion from environmental contaminants including salt spray and gas. The positive locking feature on the connector housing has a low thumb latch operation that ensures secured mating retention. Electrical performance includes: low level contact resistance of 2mΩ max. (initial); insulation resistance of 1000MΩ min; voltage rating of 600V AC (RMS)/DC and contact resistance for tin plated options is 10mΩ and gold plated options is 5mΩ max. Mechanically, the tin-plated connectors are rated for 25 cycles and gold plated connectors to 200 mating cycles. Specific application examples include 1U


rack boxes, WiMax boxes, microwave ovens, refrigerators, HDD applications, desktop PCs, blade servers, ultrasound equipment, and many others.


www.radiometrix.com


CONNECTORS FOR POWER APPLICATIONS


CADENCE ACHIEVES EDA CERTIFICATION FOR TSMC 5NM AND 7NM+ FINFET PROCESS TECHNOLOGIES


Cadence Design Systems, Inc. is continuing to collaborate with TSMC to certify its design solutions for TSMC 5nm and 7nm+ FinFET process technologies for mobile and high-performance computing (HPC) designs. As part of the collaboration, the Cadence digital, signoff and custom/analogue tools have achieved the latest Design Rule Manual (DRM) and SPICE certification for the TSMC 5nm and 7nm+ processes, and the corresponding process design kits (PDKs) are now available for download. Cadence delivered a fully integrated digital implementation and signoff tool flow, which has been certified by TSMC for the latest versions of the 5nm


and 7nm+ processes. For the 7nm+ process, the full-flow includes the Innovus Implementation System, Quantus Extraction Solution, Tempus Timing Signoff Solution, Voltus IC Power Integrity Solution, Voltus-Fi Custom Power Integrity Solution and Physical Verification System (PVS). For the 5nm process, the certified tools include the Innovus Implementation System, Quantus Extraction Solution, Tempus Timing Signoff Solution, Voltus IC Power Integrity Solution and Voltus-Fi Custom Power Integrity Solution. Cadence digital and signoff tools optimised for TSMC’s 5nm and 7nm+ process provide EUV support at key layers and associated design rules that


enable customers to achieve power, performance and area (PPA) savings at these advanced nodes. Some of the newest enhancements for the 5nm and 7nm+ process include via pillar-aware synthesis and feed forward guidance with the Genus Synthesis Solution as well as a pin-access control routing method for cell electromigration (EM) handling and statistical EM budgeting support. The Cadence-certified custom/analogue tools for the latest versions of the TSMC 5nm and 7nm+ process technologies include the Spectre Accelerated


Parallel Simulator (APS), Spectre eXtensive Partitioning Simulator (XPS), Spectre RF Option and Spectre Circuit Simulator, as well as the Virtuoso custom IC design platform, which consists of the Virtuoso Schematic Editor, Virtuoso Layout Suite, Virtuoso ADE Product Suite and Virtuoso Integrated Physical Verification System.


http://www.cadence.com/go/tsmc5and7nmdandsoip 6 OCTOBER 2018 | ELECTRONICS / ELECTRONICS


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