NEWS USB-C cable Comment I C
liff Electronics has introduced a versatile USB-C male - female
connecting cable which supports Power Delivery (PD) charging at 60 Watts (20v/@3A), USB 3.1 (Gen 1) 5Gb/s data transfer speeds, and can be used as a video cable for 5k@60Hz video output (Thunderbolt 3) and for audio transmission. The new USB-C cables can be used with a wide range of Cliff USBC XLR and DualSLIMS footprint female to Male FeedThrough connectors, available in metal or plastic.
Silicon capacitor
Murata has extended its product offering for the mobile and high- performance computing (HPC) markets with the availability of its latest silicon process technology to fabricate silicon capacitors with a density of 1.3 µF/mm². The extremely low ESL (few pH) and low ESR (few mΩ) of these devices support the highest performances of new power distribution networks (PDN) that require low impedance over a wide frequency bandwidth.
Its <40µm profile enables chip designer engineers to embed the silicon capacitor into the package as close to the active die as possible, minimizing the current’s effective path length and, thereby, minimising parasitics.
n the June issue we focus on connectors with a spotlight on demystifying IEC 6061-1 from ODU on p8. Components Bureau presents a line-up of power products that can handle the requirements of electric vehicles on p10. Our industrial electronics focus, looks at an optical solution for commercial space applications on p14. ADI investigates why you should use the same qualified rts for both positive and negative output DC-to-DC Converters on p16.
EC Electronics considers whether the automotive industry really can go 100% electric by 2030? on p18. 3D Systems discusses the potential of additive manufacturing in semiconductor fabrication on p19. Euroquartz discusses embedded buffer crystal oscillators on p20. FTDI Chip discusses key considerations for implementing a USB type-C pass-through devices with power delivery function on p22. Computer Components Ltd explains why hoarding your excess stock may be costing you more than you think on p24, plus many more latest industry focuses. Michelle Winny, Editor
Nexperia boosts production capacity
New Temperature Variable Attenuator N
experia is planning a $700 million investment over the next 12-15
months at its European wafer fabs, assembly factories in Asia and global R&D sites. The new investment will boost manufacturing capacity at all sites while supporting re- search and development into areas such as gallium nitride- based (GaN) wide bandgap semiconductors and power management ICs. It will also underpin recruitment activi- ties, with Nexperia looking to attract new chip designers.
Specifically designed and tested for critical space flight applications, the new SpaceNXT K2TVA Series offsets signal strength fluctuation due to changes in temperature – an issue that affects all RF and microwave systems. The attenuation shift over temperature is achieved using thick-film thermistor inks which are screen printed onto a ceramic substrate of Alumina. This technology was invented in-house within EMC Technology, one of Smiths Interconnects’ technology brands. Tullio Panarello, Vice President and general manager fibre optics and components at Smiths Interconnect, said: “The SpaceNXT K2TVA Thermopad Series is Smiths Interconnect’s response to the increasing demand for high-reliability connectivity in commercial space programs, particularly GEO/MEO and LEO satellites. K2TVA is the newest addition to the SpaceNXT family, an overarching initiative aimed at providing a broad range of readily accessible space qualified COTS+ products for next generation space applications”. “Our reliable and durable SpaceNXT K2TVA Thermopad attenuators help customers reach higher frequencies in the face of congestion in broadcast spectrums for wireless communications and when in orbit for communication satellites. They push the boundaries of Size, Weight and Power in a cost effective, easy to implement solution suitable for a wide array of space and defence applications.” added Eric Lakin, Vice President Finance and Strategy.
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Each product is engineered using 3D Electromagnetic Simulation (EM) software to provide excellent TCA targeting. This aids in obtaining the best attenuation flatness and Voltage Standing-Wave Ratio (VSWR) within the specified frequency band.
miths Interconnect, has released its SpaceNXT K2TVA Thermopad Temperature Variable Attenuator for gain compensation over temperature.
New SiBRAIN MCU development standard from MIKROE
MikroElektronika (MIKROE) has launched SiBRAIN, a standard for add-on development boards that facilitates the simple installation and exchanging of a microcontroller (MCU) on a development board equipped with the SiBRAIN socket. SiBRAIN enables embedded designers to try out different MCUs in a prototype system
4 JUNE 2021 | ELECTRONICS TODAY
without having to invest in expensive hardware or learn new tools. Currently, the SiBRAIN cards are available to support MCUs from major manufacturers including Microchip, STMicroelectronics, NXP and Texas Instruments, with others to follow. SiBRAIN uses the same ‘plug & play’ concept which underpins MIKROE’s Click
board product range. Depending on the MCU type, its pin count, and the number of required external components, there are different SiBRAIN add-on boards. Each board is a self-contained unit, allowing the development system to operate on a logic level, without having to facilitate the specific requirements of many different MCUs.
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