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802.11AX WIRELESS RANGE OF DEVICES PAVE THE WAY FOR THE FUTURE OF ENHANCED WIRELESS NETWORK PERFORMANCE “Generation Upload,” with real-


time cloud-based requirements. Delivering consistent


performance and reliability is becoming increasingly difficult for networks already straining to support a dramatic increase in connected devices, high definition streaming video, social media and cloud applications. Major


A


the first to offer a full MU-MI Marvell. The company claims


portfolio of 802.11ax wireless products has been released by to be MO


and OFDMA uplink and downlink based on the latest IEEE 802.11ax standards which will help the next generation of high-end users,


technology advancements are needed to better support today’s diverse users that are driving higher end emerging use cases such as virtual and augmented reality, live streaming and smart cities. Marvell believes the latest


802.11ax standard will brin g major


PROGRAMMABLE DC POWE R SUPPLIES RELEASED


enhancements to wireless networks while maintaining full backward compatibility. The standard dramatically improves network performance and reliability in dense deployments and crowde venues like airports, stad


iums and d public


shopping malls. The new Marvell wireless system-on-chips (SoCs) have one of the industry’s most complete 802.11ax implementations with full MU-MIMO and uplink and downlink, mu


lti-gigabit OFDMA


peak speeds, precision location, cloud management, best-in-class beamforming and integrated Bluetooth 5 technology. ww


gy www.marvell.com ww


TelonicInstrumentshasreleaseeaseditsnew KikusuiPW progr


Te PWR-01se seriesoff ffe


rate pow votage


PW NO-NEUTRAL WIRELESS WALL SWITCHES FOR SMART-HOME LIGHTING


A new reference design, DER-622, describing a smart wall switch compatible with wiring conditions most commonly found in residential retrofit installations has been released by Power Integrations. Typically, smart wall switches with wireless connectivity, occupancy/vacancy sensing and/or voice control require a neutral return wire to power the unit, which is not always available in retrofit situations. No-neutral products are available for legacy incandescent bulbs because the small AC input current that is allowed to leak through the load when the smart-switch is in standby mode is insufficient to heat the filament. However, for LED and compact fluorescent designs, high standby-mode current from the smart-switch’s internal power supply can lead to unacceptable flicker often known as “ghosting,” caused by the leakage energy accumulating in the lamp and initiating intermittent start-up and brief light activation. DER-622 illustrates a Bluetooth Low Energy (LE) wall switch consuming less than 500µA in standby mode.


The design is based on Power Integrations’ LinkSwitch-TN2 offline switcher ICs, which have quiescent consumption of less than 75µA. The ICs’ ultra-low current consumption and high light-load efficiency ensure compatibility with energy-efficient LED bulbs rated down to 3W and are ideal for no-neutral wall switch wiring.


The company’s LinkSwitch-TN2 devices may be configured to support flyback or buck topologies and are


claimed to deliver highly accurate output, providing voltage regulation of better than ±3%. The ICs are said to enhance system reliability by incorporating numerous safety features including input and output over-voltage protection, over-temperature, and output short-circuit protection along with a rugged 725V power MOSFET. In DER-622, the LinkSwitch-TN2 power supply IC is utilised in a non-isolated flyback topology and employs half-wave AC input rectification to reduce solution cost. The power supply provides two outputs – a 12V rail to drive a relay and a 3.8V rail to power a Bluetooth LE controller. http://www.power.com/der-622


va


grammableDCpoweowepow rsupplies. Thisse


fers400W 0W


thisaversatilerange PWR-01prov forava


variety Variableinte tomotivetest


voltageandcurrentvariableratio,makes powersupplies, the votage


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applicationsaswe PW


DCmot otors. owe exiblecurrentandvoltage


varioustypeypetyp sofsimulationssuitablefo auto


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wellassoar-pa pe


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functionthat limitstheinrushcurrent, minimisinganyharmfuleffe asDC www


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Altiumisannounc sy


AltiumDesigner18- delive systemupdates, targe enhancements,and ew fe


worktodelive


ncingthereleaseof its veringcritical fo


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featuresthatsignificantlyboost productivity fe


enddesignenv


featuresanupgradetoa64-bitarchitecture combinedwithmulti-threadedtask


modernuserinterfa fe


optimisations,enablinguserstodesignand releaselarge


ge,complex www.altium.co m


ALTERNATIVE IN WAFER-LEVEL CHIP-SCALE PA CKAGE TESTING L AUNCHE D customers, and has been designed to significantly uses electri al contact technologies


Sm hs I er onnect has launched i


Volta Series probe heads, optimised for wafer-level chip-scale package testing. As phones and smar devices get re pow rfu , so do the integrated chips that support them. V lta can be ed for testing the chips (w fer form) that are beh


Vol a Series probe heads, opti fer-level chi -scale


sed for testin


tal d spla co rolle s. T is h lp ly


del ver higher qual y product by ensuring the chips in themare up to specification, and performproperly. Volta is the result of Smiths terconnect’


ifica io rfo Vol a i Interconnect’s close collaboration with


e r sul of Sm hs close col


6 boration with


customers, and has been designed to signi outperformthe com etitio y.


outperform the competition in rel abi


ra lity antl in durability and


As phones and smart devices get more powerful, so do the integrated chips that support them. Volta can be used for testing the chips (while in their wafer form) that are behind everythin everything fromBluetooth and power management to


le in their


from Bluetooth and power management to digital display controllers. This helps deliver higher quality products by ensuring the chi s i them are up to sp


and m terials to achieve i and production efficiency.


used i


reliability. It uses electrical contact technol gies andmaterials to achieve improved performance and production efficiency.


proved perform nce


In the V lta Series, sprin probe con acts are used in place of cantilever and traditional vertical probe card technologies. This series ensures an extremely short signal path enabl ng l


In the Volta Series, spring probe contacts are place of canti ever and tradi


stable contact resistance, high current carrying capacity and longer life cycle.


capacity and longer life cycle.


materials used in the product make for improved planarity that allows increased test parallelism. http://smithsinterconnect.com/volta


planari y that al sm http://smithsinterconnect.com/volta DECEMBER JANUAR 201 ECEMBER//J JANUARY 2018 | ELEC RO ELECTRONICS CS / ELECTRONICS ELECTRONICS


Engineered plastic and machi ed ceram terials u ed in the product m ke for improved creased test paral


Engineered plastic andmachined ceramic


probe card technologies. Thi series ensures an extremely short signal path enabling low and stabl


and contact resistance, high current carrying nal vertical


ALTERNATIVE IN WAFER-LEVEL CHIP-SCALE PACKAGE TESTING LAUNCHED Smiths Interconnect has launched its ck


exboards .


getedperformance ndnewandimproved


tyandusercontrol.Thisrelease


featuresanumberof importantupdates thatwo


veronecohesive versionalso ve,end-to-


nvironment. Inadditiontothe face, thisve


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