PRODUC NEW


ODUCTS


POWER ELECTRONIC


ONICS NEW INSTRUM NT FOR CALIBRATING POW R M TERS AND ANALYSERS STRUMENT FOR CALIBRATING POWER METERS AND ANALYSERS


can be obtained by synchronising the outputs of multiple units.


For the


calibration of 3- phase power meters, it is


T


he Yokogawa LS3300 is a new dedicated, stand-alone


calibrator that is designed to help with calibrating power meters and analysers with accuracies up to 0.15%.


“The LR3300 combines a wide output (up to 1250V and 62.5A) with high accuracy (450ppm or 0.045%) and high stability (100 ppm or 0.01% for one hour). For larger current outputs, up to 180A


possible to synchronise the of two or three LS3300 inst using master/slave connections. Other features include the


ruments outputs


capability for direct calibration of the current sensor inputs of a clamp-on power meter using the instrument’s auxiliary output, and notification of when the output becomes stable to maximise the accuracy of the measurement.


This system is based on the core technology gy of Yokogawa’s AC


calibrator, the 2558A, originally released in 2013. Calibrating power meters with the 2558A, however, required two separate 2558A


instruments plus a reference power meter, whereas the LS3300 combines these functions in a single instrument to satisfy the calibration needs of lower-accuracy power meter users.


The LR3300 combines a wide output (up to 1250V an d 62.5A) with high accuracy (450ppm or 0.045%) and high stability (100 ppm or 0.01% for one hour). For larger current outputs, up to 180A can be obtained by synchronising the outputs of multiple units. ww


www.yokogawa.com ww


IMS-BASED AUTOMOTIV E EVALUATION PLATFORM


Mouser Electronics, Inc. is now offering the GSP65RxxHB-EVB


insulatedmetal substrate (IMS)-based evaluation platformfromGaN Systems. This evaluation platformhelps find ways for improving heat transfer, increased power density, and reduced systemcost of power systems in automotive, consumer, industrial, and server or data centre applications. The platform, consists of the GSP65MB- EVBmotherboard and two IMS


BLUETOOTH LOW ENERGY IC FOR AUTOMOTIVE APPLICATIONS


A new IC has been released by Toshiba Electronics Europe that is compliant with Bluetooth Low Energy (LE) core specification 4.2 including support for secure connection, LE privacy features and extended packet length support. It is well suited for use in harsh automotive environments and extended temperature ranges. The mixed-signal TC35679IFTG contains both analogue RF and baseband digital parts in a single, compact and low-profile, 40- pin 6mm x 6mm x 1mm QFN ‘wettable flank’ package, with a pin pitch of 0.5mm. This device provides Bluetooth Host Control Interface (HCI) functions alongside low energy GATT profile functions (as


defined by Bluetooth) specifications. The new IC becomes a fully-fledged application processor when used with an external non-volatile memory, or can be used in combination with an external host processor. This device is highly integrated, based on an ARM Cortex-M0 processor and includes a sizeable 384kB of on-board mask ROM to support the Bluetooth baseband process and a further 192kB of on-board RAM for Bluetooth application programs and data. A key feature is the 17 General Purpose IO (GPIO) lines and multiple communications options including


SPI, I2C and a 921.6kbps, two-channel UART. The GPIO lines offer access to a range of on-chip features including a wake-up interface, four-channel PWM interface, 6-channel AD converter and the ability to control the control interface of an optional external power amplifier for applications requiring a longer reach. www.toshiba.semicon-storage.com


evaluationmodules that each includes a high-power, bottom-side-cooled GaN Systems GS665 16B enhancemen t mode high electronmobility transistor (E-HEMT). The 650 V IMS evaluation modules are configured as a half bridge and are available in 13milliohm, 2– 4kWand 25milliohm, 4–7 kWvariants . www


ww.mouser.co m


terminals)seriespowe 2/PSL2(2terminals


PSJ SJ2/


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arenowav Inc.Co


oy evicesprov ovidecorrosionand 4A(PSJ


resistance,alongwithpulseresistance.The productsareidealfo sensingupto244A automotive


ndheat nc


applications.Therated ve, industrial


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evicesis10Wfo for1mΩty


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foraccuratehighcurrent SJ2;0.2mΩ;12W) in andpulse pow


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terminalpart temperature . www.ttieurope.co m


for0.5mΩversionsand typesatam xiaximum75°C


werdissipationof ve


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)andPSG4/PSF4(4 wershuntsfromKOA TTI,


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THERMOELECTRIC MODULES DELIVER PRECISE LASER DIODE COOLING CAPABILITY THERMOELECTRIC MODULES DELIVER PRECISE LASER DIODE COOLING CAPABILITY


A thermoelectric module (TEM) that accommodates a l ser diode butterfly package has been devel ped by Lai d.


the tem erature of sensitive optical


itiv tica


Primarily used to stabilise the temperature of se


A therm electri (TEM) that accom a laser diode butterfl package has been developed by Laird. im ily


to sta ilise


com onents in telecom an photonics industries, the miniature OptoTEC Series is designed for applications that have lower cooling requirements of 10


components in telecom and photoni s i dustries, the niature OptoTEC Ser es i designed for appl ati ns that have l wer cool


requirements of 10 watts or 26 26 DECEMBER JANUAR 201 ECEMBER//J tts or dul tes


less. The OptoTEC Series combines a small geometric footprint of less than 13x13mm with reliable and efficient heat pumping capacity. The OptoTEC design features reverse polarity that enables the


13x13m


ss. The OptoTEC Series com th reliable an


therm electric m Provi con


ire appl ati ns. es a smal geometric footpri t of l ss than efficient heat pum ing capacity. The OptoTEC design f atures r verse pol rity that enabl s the


thermoelectric module to heat or cool dependent on outdoor temperature. Providing a high coefficient of performance (COP) to minimise power consumption, the compact TEM delivers reliable solid-state operation with no sound or vibratio n to ensure long life operation with l ow maintenanc e requirements – resulting in lower total cost of ownership in laser diode applications.


g a high coefficient of perform nce (COP) to m ni ption the com act T


no sound or vibrat on to ensur re


ts – resultin The O toTEC TEM in lo


livers relia le solid sta ong life operation r total cost o


rsh avai able i


finishi g options. Assem ed with Bismuth Tel terial and therm


y conductive Al


www.lairdtech.com Series is designed for


Series is designed for low r curren www.lairdtech.com


iniu lo


le to heat or cool dependent on outdoor tem erature. se power ratio inten


th low in laser d


The OptoTEC TEM is available in multiple configurations and surface finishing options. Assembled with Bismuth Telluride semiconductor material and thermally conductive Aluminium Oxide ceramics, the OptoTEC lower current and lower heat pumping applications.


e confi urati ns and surface de sem conduct cera


id r h in cs, th lica io to th


JANUARY 2018 | ELEC RO


ELECTRONICS


CS


/ ELECTRONICS


ELECTRONICS


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