MACOM AND ST ACCELERATE GAN-ON-SILICON SUPPORT FOR 5G WIRELESS NETWORKS M acom Technology gy Solutions and STMicroelectronics have


announced the 2019 expansion of 150mm GaN-on-Silicon production capacity in ST’s fabs, and 200mm as demand requires. The expansion is designed to service the worldwide 5G Telecom buildout. This builds upon the broad GaN-on-Silicon agreement between Macom and ST announced in early 201 The global rollout of


5G networks 8.


and move to Massive MIMO (M-


MIMO) antenna configurations is expected to create a substantial increase in the demand for RF Power


estimates there will be a 32X to 64X products. Specifically, Macom


expected to more than triple dollar Amplifiers required. In turn, this is increase in the number of Power


content over the course of a five- year cycle of 5G infrastructure


estimated 10X to 20X decrease in investment and thus drive an


the cost per amplifier. “Major base station OEMs


understand they need wide bandgap GaN performance with


transformational cost structures and manufacturing capacity to meet 5G antenna cost, range and energy efficiency targets in the field. By teaming with ST, we believe Macom is well poised to provide it all - performance, cost and high-volume supply chain,” said John Croteau, president and CEO of Macom. www


ww ww.macom.com


Wa


Want to keep up to date? Th @CI_ Electronics and/


Then fo


d/or ‘Like’ us on Facebook!


followus on Twitter: Fa


Tw SMALLEST LOGIC PARTS APPROVED FOR AUTOMOTIVE FROM NEXPERIA


Nexperia,has announcedthatover twenty logic types inthe company’s space-savingleadlessMicroPakpackages arenow AEC-Q100qualified.These logic solutions areoneof the smallestdevicesof their type suitable for automotive. The company’sMicroPakpackages feature the same silicon gerPicoGateoptions, ensuringthat electrical formance remains identical toleadedequiva


ge re


die as large perf


rfo valentswhileprov


device andboard. range


inve


demultiplex Schmitt-trigg


ow


packages saveupto64%PCBspace comparedtoleaded equiva


betwe


verters/drivers,bus switches, translators, flip-flops,decoders/ exers,multiplex rs, latches, lev gge


This ra ge includes ga vers


gerdev evices. exers eve vel shifters and gates, analoguesw switches,buff ffe s/ fers/ s/ ovidingamore reliablebondbe ween


Twenty solutions inXSON6(SOT886andSOT1202) and XSON8(SOT833-1 andSOT1203)packagekages are va immediately inNexpeexperia’sAutomotive


re available veportfolio–including valents.MicroPak


low-power single-gate anddual-gate functions inAUP(0.8V to3.6V),AVC(1.2Vto3.6V) andLVC(1.65Vto5.5V) technologies, rangira gingfromga more


redevices fromNexperia’sMicro ex


said: “These are ve


ww


gates totranslators. Inaddition, roPakoff


for automotive applicationsuponrequest.


automotive industry DA Adva


andADAS (AdvancedDrive Assist Systems)where miniaturisationisofparamount importance.” www


re ww.nexperia.com


Ghislaine Jilisen-Janssen,productmanager foge forMini Logi re the smallest logicpartsqualifiedfo ry.Applications include in-car entert ver As


for the rtainment gic,


Cadence Design Systems, Inc. has announced that products in the Cadence Tensilica functional safety portfolio and its design processes tion of ISO 26262 ASIL D for the


compliance up to achieved certifica


development of automotive fferingcanbe released


applications. The Tensilica Functional Safety products comply with ISO 26262 1st Edition and 26262:2018 2nd Edition standards. Cadence works with safety industry leaders such as SGS-TÜV Saar and TÜV SÜD to ensure and certify compliance up to ISO 26262 ASIL D. TÜV SÜD has certified ASIL D compliance for Tensilica development tool software and libraries, and SGS-TÜV Saar has certified ASIL D compliance for the Tensilica IP design process.


www.cadence.com ww


SURFACE MOUNT MINIATURE OV CONTROLLED CRYSTAL OSCIL


E


MC test receives new software evolution for


automation and control of EMI systems on p6. Learn more about testing the boundaries of


set of design challenges with it, arrives, bringing a whole new 5G as this latest capability


development of USB Type-C on p8. Through the


specifications, higher levels of and USB Power Delivery


those same mobile devices, on power can now be used by


p12. An ultra-reliable, cost- effective connector system offers an innovative solution


applications, on p14, plus more for disposable medical


of the latest industry updates and breaking news. Michelle Wi ny Editor


Winny 4 MARCH 2019 | ELECTRONICS


Frequency control specialist, Euroquartz has launched a newrange mountminiature ove


ge of surface ven-controlled


crystal oscillators (OCXO) offering one of the best frequency stabilities froma quartz IT cut cry


TheOC51T series offers frequencies rystal.


4.1mmminiature SMD 4-pad package from10 to 40MHz in a 9.7 x 7.5 x


with 3.3 and 5.0V supply vo options.With voltage


voltage ge control as ge ge standard,OC51TOCXOs deliver


FOR HIGH STABILITY APPLICATIONS


TY


LATORS EN-


frequency stability of ±20ppb (parts per billion)maximummaking themideal for use in applications exceptionally accurate


timing signals requiring


including radio transmitters, cellular base stations,military communications equipment and for precision frequency measurement.


Frequency stability versus


temperature is ±10ppb over -30 to 70°C and ±20ppb over -40 to 85°C. Against vo


voltage


±10ppb for a ±5%input voltage change Warmup time of 5minutesmaximum results in frequency outputwithin ±0.1ppmof reference frequencywhile frequency stability against ageing is ±3.0ppbmaximumafter 30 days, ±600ppbmaximumfirst year and ±3ppmmaximumover 10 years.


ge change, stability is ge


ge ge.


Delo has developed an encapsulant with very high resistance tomedia and temperature.With to an optimised curing time, DeloMonopox GE6515 also accelerates production processes. The product is particularly well suited for encapsulating electronic components in automotive


Additional specifications include 7ns maximumrise and fall time (20-80% ofwaveform), output load of 15pF, duty cycle of 50%±5%, power dissipation of


Initial calibration tolerance is 500ppb 0.4Wwith 350mA current at turn on.


maximum. www


ww.euroquartz.co.uk


applications. It is a one-component, purely heat-curing epoxy resin. The encapsulant achieves very high


strength even at high temperatures. It exhibits strength values of 20MPa on aluminimat a temperature of 150°C and 14MPa in the upper service temperature range of 200°C.


ww www.delo-adhesives.com/en / ELECTRONICS Toshiba Electronics Europe has


announced its range of single-supply single-gate logic devices. In total the lineup consists of 31 devices that simplify


fy the design of voltage-level


translation as use communication b


etween devices, such d in data


as betweenmicroprocessors and


peripherals. These single-gate devices are provided in tiny packaging that ensure that voltage translation can be implemented even in applications with limited board space.


www.toshiba.semicon-storage.com ww


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