CONTRACT MANUFACTURING
How contract manufacturers can enhance product quality
through effective cleaning Elizabeth Norwood, a senior chemist at MicroCare, LLC, says rising demands for performance and reliability are reshaping expectations in the electronics sector
F
or contract manufacturers, the challenge of delivering high-quality assemblies has increased as devices shrink, and printed circuit board assemblies (PCBAs) become more densely populated. Even microscopic contamination can affect product performance.
For contract manufacturers looking to meet the exacting standards of their OEM customers, selecting the right cleaning solution is no longer optional, it is essential to long-term quality assurance.
Understanding the complexity of modern assemblies
The advancement of PCBA design has introduced new challenges. Micro components such as flip chip, ball grid arrays (BGAs), quad flat no-lead (QFN) packages, miniature diodes, resistors, and capacitors, are now routinely incorporated into increasingly compact layouts. The frequent use of low-standoff MOSFETs and zero-clearance components further complicates cleaning processes. These tight configurations often trap flux residues and other process contaminants in spaces where traditional cleaning methods may be ineffective.
In this environment, achieving thorough cleanliness demands more than high- performance cleaning fluids; it requires carefully optimised processes tailored to the specific contamination, design, and materials of each assembly. Manufacturers must consider factors such as component sensitivity and material compatibility when developing their cleaning strategies.
Cleaning for Reliable Performance No single cleaning approach fits all applications. Contract manufacturers must adopt tailored methods based on the specific requirements of each project. Selection criteria should include: Type of Contamination: Flux residues, adhesives, solder paste, and environmental contaminants require different chemistries and process conditions for effective removal. Component Sensitivity: Delicate components demand gentler cleaning formulations to prevent damage. Material Compatibility: Cleaning solutions must be compatible with substrates, plastics, metals, and other assembly materials to avoid adverse reactions. Geometry: The physical structure of the PCBA, including low-clearance areas, necessitates advanced cleaning techniques such as vapour degreasing.
Choosing the correct cleaning process involves close collaboration between manufacturers, cleaning fluid manufacturers, and sometimes OEM customers to balance
26 MAY 2025 | ELECTRONICS FOR ENGINEERS
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