INTERCONNECTION


is the cost-effective option. Active alignment, using real-time optical feedback, leads to  but it is more complicated and expensive.  photonic devices. Even small temperature changes can cause problems. Advanced levels of thermal management and thermal design are important to ensure that peak performance and 


achieved. Integrating  electronics 


thermoelectric coolers (TECs) and heat sinks,         


 routing or taking up extra space as optical interconnects can deliver multi-terabit-per-  minimal signal loss.


 components. Using built-in test   and standardised test procedures are advisable. The manufacturing process is also more complicated as optical and electrical components have been integrated into a package. Multiple  that there are increased    


Photonic package design advances Copper interconnects have been used for


 things are changing again. It has become apparent that copper interconnects are     and Co-Packaged Optics (CPO) enables the boundaries of copper-based interconnects    photonic package design are required to   novel developments in semiconductor and photonic packaging, offering unique solutions and skills for photonic package/CPO design,  simulation, test programs and package 


 interconnects and open the door to an   semiconductor packaging, so leveraging  vital.


MARCH 2026 | ELECTRONICS FOR ENGINEERS


33


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46