TEST & MEASUREMENT


cleanroom and vacuum applications. Compact, high-sensitivity force sensors cover ranges from nanonewton to kilonewton, supporting applications from precise grinding, CMP, bonding to chiplet placement and packaging. By detecting micro-forces in real time, these sensors enable precise process control at bonding points, minimise the risk of die damage and maintain stability even at high throughput. As placement heads accelerate and decelerate, Acceleration sensors track micro-vibrations and shocks that can shift dies by mere microns. When the process   sensors provide real-time cavity monitoring  secure stable process conditions. To tie these signals together, the industrial  with real-time signals for the semiconductor equipment control system. Designed for multipurpose use with piezoelectric sensors,


 Kistler enables analogue and digital real-time force monitoring and closed-loop control in 3D chip integration.


 from sensors into voltage and/or digital outputs. This closed-loop control system ensures precise bonding alignment and prevents defects caused by overpressure. Additionally, handheld diagnostic tools  engineers to validate process parameter  anywhere.


Sensor placement: There is no one- 


Ultra-compact piezoelectric force sensors, such as the Type 9172CD from Kistler, measure micro- forces ranging from sub-newton to kilonewton, providing high-resolution, real-time data directly from critical process points. This helps manufacturers prevent failures such as die shift, and pressure-induced microcracks.


Designing equipment for heterogeneous 3D integration means more than simply selecting the appropriate sensing technology. It also requires placing sensors  The ideal measurement location may not offer the environmental conditions needed  piezoelectric sensors can tolerate high temperatures, they still have operational limits. In certain applications, it may be necessary to use a more heat-resistant sensor or adjust the placement to ensure equipment protection and reliability. Kistler works closely with semiconductor equipment manufacturers to identify the most sensitive points within their systems, ensuring that force, pressure and vibration sensors are embedded where they capture the most informative data. Further services such as calibration, and system validation during equipment build, ensure long-term accuracy and reliability.


 and strategic advantage in 3D integration


The new Miniature Triaxial Acceleration sensor Z22198 from Kistler is designed for high-precision vibration analysis, including micro-vibrations and shocks. The lightweight miniature Sensor is ideal for dynamics testing and monitoring, especially in tight spaces.


Delaying investments in advanced sensor systems and smart manufacturing technologies presents risks for semiconductor equipment manufacturers. As product requirements evolve – such as miniaturisation or the use of new


The multifaceted handheld instrument 5811A from Kistler integrates data acquisition with support for piezoelectric sensors, insulation tests, and monitoring of IO-Link or ±10 V analog devices, ensuring reliable quasi-static and dynamic measurements across a range of industrial applications.


MARCH 2026 | ELECTRONICS FOR ENGINEERS 31


materials – process stability can be  completed machines is often technically challenging. Space constraints and even    performance of solutions integrated during the design phase. Looking ahead,  wafer materials, like Gallium Nitride and Siliciumcarbid, and the further advancement of manufacturing processes will only increase the need for better monitoring strategies. High-resolution sensors will become even more central to securing long-term competitiveness.


The measurement of cavity pressures up to 200 bar in low-viscosity thermoset resins is possible with robust piezoelectric cavity pressure sensors, such as the Type 6183C from Kistler, delivering precise, real-time data for RTM, LSR, and SMC processes. This guarantees optimal  defects in lightweight automotive and aerospace components.


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