COMMENT
Optimising production high-volume low complexity printed circuit board
By Choon-Hin Chang, product manager, Keysight Technologies E
lectronics have become ubiquitous today, with the emergence of connected products integrated into various aspects of our lives, such as internet of things (IoT) devices, consumer medical devices and automotive electronics.
These products share a common characteristic — high-volume productions, yet low board complexity. This poses a keeping up with the production rate while testing boards at scale, necessitating a more cost-effective way of producing and testing these products at scale.
The rapid evolution of technology has triggered a surge in the demand for cost- effective electronic products, creating an unprecedented need for high-volume manufacturing. Manufacturers are under pressure to revamp their manufacturing processes, reduce costs and improve production timelines to meet the increasing demand for electronic devices. Consequently, the in-circuit testing processes applied to these products must also adapt and align with these dynamic industry demands.
In response to this shifting landscape, of a transformative journey. The imperative is to produce electronics at a lower and agility. The multifaceted challenge encompasses streamlining manufacturing processes, trimming operational costs, and accelerating production cycles. This approach necessitates an intricate interplay of innovative methodologies and advanced technologies that optimises the in-circuit testing procedures needed for ensuring the quality and functionality of electronic products, as shown in Figure 1.
Challenges in conventional test approaches
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increase in demand for high-volume production of low-complexity printed circuit boards (PCBs). As a result, manufacturing processes must streamlined by improving production times.
One key aspect of ensuring high-quality production hinges on the testing process, which is particularly crucial for boards that programming. The conventional testing protocol for such boards typically involves multiple test stations, encompassing in- functional testing. However, this methodology is unsuitable for high-volume production due to its constraints on test throughput and the high costs associated with multiple test stations.
Navigating high-volume manufacturing: Industry approaches and solution
One way to overcome testing challenges for high-volume manufacturing of low- complexity boards is to adopt the PCB panelisation manufacturing technique. Using highly panelised boards has become a common technique in manufacturing, improving throughput and increasing production volumes. Low-cost electronics are
MARCH 2026 | ELECTRONICS FOR ENGINEERS
Figure 1. A typical production line with multiple test stations
also usually smaller and lower in complexity, into a panel of manageable size. In PCB panelisation, manufacturers create one board from several boards and assemble them to form a single smaller and less complex boards into a panel of manageable size, making it more cost-effective to move them through the assembly line.
The boards that make up the panel enable operators to load just one panel to test all boards simultaneously. During the breakout process following assembly, the panel divides into separate PCBs, a procedure known as depanelisation. The individual boards can be readily depanelised or separated from the array for packaging or installation into products.
Assembly of low-complexity boards in production is often rapid, necessitating quick turnaround times for testing to meet the production rate.
The following are examples of high-volume, low-complexity board devices across various industries: • Automotive electronics, including sensor boards, controller boards and engine control units (ECUs)
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