AUTOMOTIVE ELECTRONICS
Advance the Development of Centralised Car Compute and SDV
T
he rapidly evolving automotive landscape is shifting from the traditional distributed architecture to centralised compute architecture coupled with domain integration. There is also mass deployment of advanced driver-assistance systems (ADAS), the drive towards more autonomy. These transformations in turn are fueling the change from a hardware-central model All these changes are driving an increase in the demand for SoCs to support higher computing needs. Along with the SoCs, a reliable open development environment is also necessary to build future vehicles and continue to evolve.
Renesas is expanding its scalable SoC SoCs to deliver new solutions, integrating the latest cutting-edge chiplet and process node technologies for automotive in Renesas’ for centralised compute and cross-domain applications and for high autonomy. The scalable portfolio offers solutions to all levels of vehicles ranging from entry mass market enables software reuse and portability across devices and generations with a common
architecture, creating a sustainable and evolving automotive industry. The key value mixed-criticality support.
Scalable High-Performance Platform for Centralised Architecture
automotive cross-domain SoC, is a high-performance compute platform that is open, innovative and automotive-focused. The high performance of the monolithic design can be scaled further with AI and a graphics chiplet extension using the latest compute and interconnect technology. Key features of R-Car X5H: •
compute applications.
• • • •
cores for RT processing, delivering over
and multi-display support for video and
Flexible and Modular Architecture to Meet OEM Processing Needs
Figure 1. R-Car X5H SoC Functionality 6 MARCH 2025 | ELECTRONICS FOR ENGINEERS
In a centralised architecture, domain integration is seen at varying levels. At the entry segment, we see a full fusion of ADAS cost, while at the mid and higher segments, a more common. Be it full-fusion or is designed to address all application die-to-die interconnects, the AI and graphics performance can be further extended with chiplet extensions depending on the application needs. The chiplet approach
Figure 2. Flexible Compute with NPU and GPU Chiplet Extension
enables higher performance scaling heterogeneously. The fusion application using cockpit and gateway solution stacks, both ready to use.
At the very high-end or premium car computer architecture is adopted especially for ADAS due to the very high compute heterogeneously via AI chiplet extension in multi-die packaging. Combined with Renesas’ including AI toolchain, network/model support and cloud native support, customers have an end-to-end platform for all their autonomy needs.
facilitate interoperability in a multi-die ability to integrate custom accelerators. The chiplet approach is adopted to enable such open architecture while scaling for higher performance with less overhead. All these extensions are compliant with the latest automotive safety and security requirements.
multiple domain functionalities into a single module is thermal or power management.
Architectures with R-Car Gen 5 SoC Roopesh Panthalath, senior staff product engineer, Renesas
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