THERMAL MANAGEMENT
data centre design By Matt Evans, CEO of the data centre solutions business at LFB Group.
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oday’s data centres face relentless pressure to process faster, store more data and operate 24/7. Adding to the pressure, is a growing shortage of skilled engineers and technical experts. Data shows that more than half of data centre operators are struggling to get their staff. This talent gap will, inevitably, slow project delivery and hamper the industry’s ability to innovate at the speed required.
Rethinking cooling to meet rising demands
Power densities in data centres are rising fast. The threat of rising loads has been kept at bay for years with typical rack densities staying in the 5-25kW range - AI workloads provide a very tangible challenge. With current AI systems breaching the gap between air and liquid cooling, the future and exceeding modern nuclear reactor fuel rods; NVIDIA have announced Ruben Ultra and Kyber platforms operating at 600kW and >1MW respectively.
To keep pace with rising demand, data centre cooling must evolve beyond conventional approaches. The future management systems - those designed not just for today’s loads, but with tomorrow’s potential in mind.
By shifting the mindset from reactive to strategic, systems can be deployed which changing workloads, deliver precision control and simplify maintenance and upgrades. This reimagined approach must consider the entire cooling ecosystem, evolving traditional methods into agile, future-ready solutions. For example, both our Fan Wall Unit- ApX Series and CDU-ApX Series are built parametric approach, capacities and system parameters can be tailored to ensure robust
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control in dynamic environments - this adaptability ensures they scale seamlessly with evolving power densities and future expansion needs.
Engineering partnerships for success
In this new era, success hinges on an engineering-led, collaborative approach, which is rooted in trust, experience in the industry and long-term client partnerships. These relationships extend far beyond transactional ‘you buy, we sell’ deals. They form interconnected ecosystems where all stakeholders - including manufacturers, integrators and operators - work together to share insight, drive continuous improvement and adapt to evolving demands. From logistics and installation to performance optimisation and long-term maintenance, every stage is planned with the full picture in mind.
This hands-on, engineering-driven model streamlines deployment, reduces complexity and ensures our partners are supported at every stage.
Navigating complexity with agile cooling
While long-term partnerships provide JULY/AUGUST 2025 | ELECTRONICS FOR ENGINEERS
stability, day-to-day operations demand unpredictable and rack densities more feature of successful thermal management. Even a small design tweak - like altering dimensions or repositioning access points - can trigger a chain reaction of delays, engineering rework and increased cost. This rigidity is a byproduct of traditional mass manufacturing, where customisation is often constrained by rigid standardisation. to the rapid changes we are seeing across the industry. But the good news is, with an agile product framework, you don’t have to reinvent the wheel every time you embark on a project.
parametrically ensures that thermal management systems not only meet today’s demands but are able to scale effortlessly as workloads evolve.
No project is ever seamless, and there are always challenges along the way, but this approach enables us and those that follow this method to deliver the agility and reliability that modern data centres need to navigate complexity, adapt swiftly and stay ahead in the ever-evolving landscape.
Staying cool under pressure: How smarter thermal management is reshaping
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