Sensor Techniques’ load cells and strain gauges are used in industrial,
harsh and ATEX-rated environments, in addition to applications in automotive and transport weighbridges, elevated platforms or scissor lifts, etc. Rob Forrest, founder of Sensor Techniques, commented: “Charcroft is a specialist distributor and manufacturer or high-reliability components and also has maintained a long-term franchise with VPG. This franchise has provided vital experience in supporting customers for load cells from Tedea Huntleigh, Sensortronics, Celtron and Revere, and provides an excellent foundation for the acquisition of Sensor Techniques.”
By optimising conductor cross-sections, TEXILine Heli Twist cables achieve up to 30% weight reduction compared to
traditional alternatives. This not only minimises material usage but also simplifies handling, reducing installation time and accessory requirements. The helically laid-up design ensures resilience against electro-mechanical forces, maintaining reliability during short circuits. Available with copper or aluminium conductors, each cable is insulated with XLPE for enhanced safety and longevity. Flexible Class 5 conductors facilitate easy installation, while optional copper braid screens provide improved electromagnetic compatibility (EMC). The innovative twisted structure promotes efficient heat dissipation, allowing for higher current- carrying capacity in compact spaces and challenging conditions. Designed for 1kV AC and higher-voltage DC systems, the TEXILine
Heli Twist range meets the evolving demands of modern marine power solutions. Amokabel continues to prioritise sustainability and efficiency, delivering cables that enhance both operational performance and environmental impact. For more information, contact Aerco today and discover the ideal
cable solution for your needs.
Hosted by the National Manufacturing
Institute Scotland (NMIS), the new development, which is funded by Innovate UK and set to open in 2025, will be located in Inchinnan, Renfrewshire, forming part of the University of Strathclyde’s Advanced Net Zero Innovation Centre (ANZIC). Providing an advanced packaging scale-up line for power electronic
semiconductors, this new capability – a first in Europe – will support the faster production of semiconductor chips, reducing packaging times for UK firms from months to just days. Packaging, a key stage in semiconductor manufacturing, protects core
components and readies them for use in a range of technologies. The process is evolving to accommodate more devices and functionalities within single packages and the UK’s semiconductor packaging market, valued at £500 million and employing 15,000 people, is projected to reach £750 million by 2030, with the NMIS facility set to further accelerate growth. The NMIS scale-up packaging line will support UK companies with
developing new solutions and expanding the use of UK-manufactured wafers, while addressing critical production gaps. By tapping into the expert support and state of the art equipment, firms can potentially unlock access to the growing market for semiconductors, reinforcing Scotland’s position as a hub for advanced manufacturing and innovation. Professor Matt Boyle, director of electrification at NMIS, said: “At the NMIS
we work with manufacturers of all sizes to help them boost productivity and efficiency, and we’re excited to help grow the semiconductors supply chain here in the UK and secure a lead in sector innovation. “Working closely with the Compound Semiconductor Applications (CSA)
Catapult, our focus is on highly specialised packaging, using our established engineering expertise to stay ahead of rising demand. Facilities and equipment for packaging have until now been the missing piece of the puzzle, and the new packaging line unlocks the potential to reshore manufacturing to the UK. “This is just the beginning – our aim is to accelerate semiconductor
manufacturing, allowing companies to explore new technologies and implement testing without disrupting day-to-day production. We look forward to collaborating with firms from across the supply chain and within our vast network, including the High Value Manufacturing (HVM) Catapult.”
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