by Shane Geary, SVP Manufacturing & Operations, Pragmatic Semiconductor
Ubiquitous connectivity is reliant on an abundant supply of semiconductors – yet existing methods of semiconductor fabrication would struggle to satisfy the demand for billions of smart items. IoE devices typically don’t use the latest cutting-edge chips, but instead tend to rely on so-called ‘legacy’ chips. Despite the name, legacy chips are not old technology. They’re constantly
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being adapted for new requirements and applications, and play a central role in a manufacturing economy. Their importance was underlined during the recent pandemic, when demand outstripped supply. The world watched in disbelief as entire production lines ground to a halt and everything from cars to TVs went unshipped, hampering an already beleaguered economy. So, if supply is what’s holding back the IoE, why don’t we just make more chips? The fact is that expanding the production of legacy chips isn’t easy. They’re often produced in fabrication plants (fabs) using older equipment, and this equipment is less
readily available. Furthermore, building a new fab is costly and time-consuming. The long lead times and costs associated with chip manufacture are also
a factor. Ubiquitous connectivity requires a low-cost solution that can be swiftly proliferated, at scale. To sustainably achieve pervasive connectivity, we need to look to new methods and materials.
Instead of relying on traditional, outdated modes of semiconductor fabrication, new methods of manufacturing combined with advanced materials are signalling a radical shift in the semiconductor industry. Flexible integrated chips remove the need for the complex, high temperature processes required for silicon chip fabrication, and instead rely on simple spin-coating of polyimide onto a glass carrier. This process takes place at lower temperatures, requiring significantly less energy, water and chemicals. This has a dramatic impact on the carbon footprint, as well as set-up costs and production timescales. In fact, flexible chips can be delivered in as little as four weeks. The
implications for innovation are multiple: rather than adhering to ‘right-first-time’ workflows, designers can take advantage of rapid cycle times to amend and refine designs on the fly, iterating to achieve optimal performance. Low non-recurring engineering costs also lower the barrier to entry, making it cheaper and easier than ever before to bring designs to life. So what does this mean for IoE? The flexibility, low cost and low carbon
footprint of flexible chips mean they can be easily integrated into everyday objects. This makes them ideal for the IoE and the generation of data to feed AI models, enabling efficiency and insights at scale. For FMCG, that connectivity might deliver better product authentication, or one-tap consumer engagement to create personalised experiences. In healthcare, their flexibility makes them ideal for wearable patches. They could also play an important role in a circular economy, providing a scalable way to track reusable packaging or ensure accurate recycling at end of life. We’re at the cusp of an IoE revolution, but we can only truly capture the
value if intelligence can be deployed at scale. Flexible chips are the key to unlock that potential and finally make the IoE a reality.
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