ESI Automotive is therefore advising
automotive OEMs to take a systems-level look at their supply chains and take immediate action to minimise the risk of over-reliance, as the global semiconductor shortage continues to cripple global production schedules. The company is already working with
automotive manufacturers to utilise unique material sets which can reduce the semiconductor content in some vehicle systems by as much as 75%, helping several OEMs overcome some of the market challenges faced in the past 18 months. With the semiconductor shortage continuing
to wreak havoc on new vehicle schedules and Taiwanese companies forced to move production of chips to China in an attempt to bypass COVID restrictions, it is expected thatmaterial shortages
supply chains and triggered the need for review. “By viewing future vehicle manufacture at a
systems-level, it is possible to understand in greater detail where these vulnerabilities exist and make subtle changes which not only aid vehicle performance, but which reduce over-reliance on materials and better spreads supply chain risk. “For example, we are working with one OEM
to understand their process for EV powertrain design. They had always used an inverter type that was soldered. Therefore, they required semiconductor devices to solder to the substrate –more than 90 individual devices! “We worked with themto instead use silver
sintering technology, which enabled themto reduce semiconductor content by 75%. This decrease not only brought a weight reduction,
will not be resolved fully until late 2022, if not later. Chris Klok, director of vehicle electrification at
ESI Automotive, explained: “Automotive OEMs are facing a perfect storm of material supply, with semiconductormaterials already behind production schedules, and a shortage of rubber andmetal all fueling further chaos. The past 18months have demonstrated vulnerabilities in traditional vehicle
“We started off by building the device for
Attomarker, but it quickly became apparent that there were other areas where we could assist to deliver the project such as machine validation testing,” explained Robert Badcock, managing director at Mantracourt. “We undertook pre-compliance testing and discovered the electronics and communication systems in the device could be improved. “We designed a new power distribution module,
new USB components and a USB hub, as well as replacing several of the specified cables in the unit.
Overall, we managed to improve the kit while reducing around 60% of the cost and also reduced noise, which is important from an EMC point of view.” The seven-minute COVID-19 antibody testing device is due to be rolled out across the UK.
Schematic symbols and PCB footprints for
electronics design are included, as well as 3D mechanical models to ensure proper mechanical clearances and design visualisation. Engineers
can also see a real-time report generated by SnapEDA’s patented verification technology, to gain instant transparency into manufacturability. “Our new collaboration brings thousands
of new high quality CAD models to engineers, streamlining their design process and enabling them to move to scale faster and more reliably with Panasonic components,” said Natasha Baker, founder & CEO of SnapEDA.
6
but also a reduction in dimension and cost. This simple change added benefits to the vehicle and helped reduce their over-reliance on one type of material. It’s just one example of where a slight change can add resilience, when production is viewed at systems level.”
The new release delivers hundreds of new
user-driven enhancements that accelerate innovation, and streamline and speed up the product development process. It includes: • New workflows and feature enhancements in assembly and part design, drawing detailing, simulation and product datamanagement.
• New features in parts such as hybrid modelling and creating standardised external threads.
• User interface enhancements to shortcut bar, configurationmanagement, geometric tolerancing andmore.
• Quality and performance improvements when working with large assemblies, importing STEP, IFC, and DXF/DWG files, detailing drawings,managing product data.
• Automatic assembly performance optimisation without worrying about modes and settings.
• Fastest graphics to date. • Access to the 3DEXPERIENCE platform’s collaborative digital environment to improve innovation and decision-making.
• Access to the cloud-based 3DEXPERIENCE Works portfolio of expanded applications for design, engineering, simulation, manufacturing, and governance.
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54
