• • • SMART BUILDINGS & IOT • • •
specific functionality. The result is a chip that provides considerable space savings and lower installation costs.
Dies containing the ICs can be stacked vertically on the substrate, connected by fine wires bonded to the package. Where a manufacturer would have needed multiple specialised IC devices to be assembled and connected on a PCB, that level of connectivity can be integrated into the package itself with a SiP.
reliable than having multi-chip systems. Ultimately, a SoC product is designed to implement an entire embedded system on a single chip, thereby producing a system that is smaller, faster and can be easily integrated into its destined environment.
SiP
However, sometimes it is not possible to integrate all the system features into a single die and this is where a System in Package (SiP) comes to the fore. A SiP is typically an ASIC in bare die form that’s integrated with another IC, for example a microelectromechanical sensor (MEMS) or a
communications die such as BLE, all in a single package.
The ASIC provides the signal processing and sensor interface, while the MEMS acts as the sensing element and the BLE for a complex communications protocol.
Where a SoC refers to the encapsulation of CPUs, micro-controllers and other supporting hardware onto a single chip, a SiP is a further level of integration where multiple dies are integrated inside a single package.
While a SoC contains all the required electronic elements, a SiP comprises individual chips accommodated in one package, each with a
One of the most notable advantages of using a SiP is its small size. Since a SiP uses IC manufacturing processes along with bare silicon die, it significantly reduces the size of the subsystem. This reduction in size allows designers to reduce the size of their PCB, supporting form factors that wouldn’t otherwise be possible. Furthermore, reduced assembly, PCB and materials costs will also make SiP more affordable, further increasing its accessibility. For a manufacturer wanting to integrate more sophisticated, sensor-driven technology into their product, they may be pleased to know there are several options available at their fingertips. ASIC, SoC and SiP can all offer a multitude of performance gains that will help a product stand out from the competition.
Knowing which option to choose, however, will require guidance from an expert in the design, test and supply of these integrated circuits. To learn more about the ASIC, SiP and SoC options Swindon can deliver, visit the website to arrange a no-obligation first meeting.
38 ELECTRICAL ENGINEERING • MAY 2023
electricalengineeringmagazine.co.uk
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